Abstract: An assembly includes a substrate with a metallization having a first conductor structure and a second conductor structure, with the first conductor structure being arranged at least partially within the second conductor structure. An electronic component is connected to the first conductor structure. A thermally conductive housing element is designed to surround the electronic component and connected with a material bond to the second conductor structure. A thermally conductive filler material connects a cover surface and a side surface of the electronic component to the housing element.

Abstract: A cooling apparatus for a semiconductor arrangement is made by producing a base body with a flat surface, opposing first and second lateral surfaces, and channels extending continuously from the first to the second lateral surface and parallel to the flat surface, with adjacent ones of the channels being each connected via a web. Bilaterally introduced in the base body are contacting grooves and connecting grooves in parallel relation to the flat surface by partially removing the web between the adjacent channels such that the connecting grooves are arranged between the adjacent channels, the channels are arranged between the flat surface and the contacting grooves, and the connecting grooves protrude deeper into the base body than the respective contacting grooves. The channels are closed to form a closed channel structure which is filled with a heat transfer fluid so that the base body is directly contacting the heat transfer fluid.

Abstract: An electronic assembly has a printed circuit board with first and second component sides. A cooling element on the first component side is cooled by forced convection produced by a convection unit. A majority of electronic components are arranged on the second component side. Non-current-conducting plated-through holes are used to transport thermal energy generated by an electronic component from the second component side to the first component side. The thermal energy can be transported away from the printed circuit board and dissipated by means of the forced convection. A corresponding method for dissipating heat from an electronic assembly is also disclosed.

Abstract: An electronic assembly has a printed circuit board with first and second component sides. A cooling element on the first component side is cooled by forced convection produced by a convection unit. A majority of electronic components are arranged on the second component side. Non-current-conducting plated-through holes are used to transport thermal energy generated by an electronic component from the second component side to the first component side. The thermal energy can be transported away from the printed circuit board and dissipated by means of the forced convection. A corresponding method for dissipating heat from an electronic assembly is also disclosed.