Abstract: An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.

Abstract: An illumination system of a micro-lithographic projection exposure apparatus is provided, which is configured to illuminate a mask positioned in a mask plane. The system includes a pupil shaping optical subsystem and illuminator optics that illuminate a beam deflecting component. For determining a property of the beam deflecting component, an intensity distribution in a system pupil surface of the illumination system is determined. Then the property of the beam deflecting component is determined such that the intensity distribution produced by the pupil shaping subsystem in the system pupil surface approximates the intensity distribution determined before. At least one of the following aberrations are taken into account in this determination: (i) an aberration produced by the illuminator optics; (ii) an aberration produced by the pupil shaping optical subsystem; (iii) an aberration produced by an optical element arranged between the system pupil surface and the mask plane.

Abstract: An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.

Abstract: A arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: An imaging device in a projection exposure machine for microlithography includes at least one optical element and at least one manipulator, a linear drive for manipulating the position of the optical element. The linear drive has at least one moving element, the moving element having a shearing part and a lifting part. The shearing part is arranged to move the optical element and the lifting part is arranged to move the shearing part. The linear drive has a supporting element which is in contact with and prevents movement of the optical element while the shearing part is moved by the lifting part.

Abstract: An optical beam transformation system has a sequence of optical elements arranged along an optical axis of the optical beam transformation system and designed for transforming an entrance light distribution striking an entrance surface of the optical beam transformation system into an exit light distribution emerging from an exit surface of the optical beam transformation system by radial redistribution of light intensity. The optical elements include a transformation element causing a radial redistribution of light intensity and having a transformation surface inclined to the optical axis and causing a polarization-selective reflection of a light distribution incident on the transformation surface according to an efficiency symmetry characteristic for the transformation surface.

Abstract: An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.

Abstract: An imaging device in a projection exposure machine for microlithography includes at least one optical element and at least one manipulator, a linear drive for manipulating the position of the optical element. The linear drive has at least one moving element, the moving element having a shearing part and a lifting part. The shearing part is arranged to move the optical element and the lifting part is arranged to move the shearing part. The linear drive has a supporting element which is in contact with and prevents movement of the optical element while the shearing part is moved by the lifting part.

Abstract: A arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: A arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.

Abstract: An optical measuring system is provided with a measuring machine that has at least one measuring element for determining locations and at least one measuring element for determining angles. At least one common reference surface is provided for the location-determining measuring element and the angle-determining measuring element.

Abstract: Optics, such as, for example, microlithographic projection exposure apparatus illumination optics, as well as related systems, methods, components and devices are disclosed.

Abstract: An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.

Abstract: An arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: A projection exposure apparatus for microlithography has a light source, an illumination system, a mask-positioning system and a projection lens. The latter has a system aperture plane and an image plane and contains at least one lens that is made of a material which has a birefringence dependent on the transmission angle. The exposure apparatus further has an optical element, which has a position-dependent polarization-rotating effect or a position-dependent birefringence. This element, which is provided close to a pupil plane of the projection exposure apparatus, compensates at least partially for the birefringent effects produced in the image plane by the at least one lens.

Abstract: A arrangement serves for the adjustment of an optical element (1), in particular of a lens in an optical system, in particular in a projection lens system for semiconductor lithography. The optical element (1) is mounted in a mount (3) by means of a number of bearing feet (2) distributed over the circumference of the optical element (1) and is selectively deformable by actuators (5). At least some of the bearing feet (2) are engaged by the actuators (5) in a region of the respective bearing foot (2) in such a way that the respective bearing foot (2) can be displaced in the direction of the optical axis (7).

Abstract: The invention relates to an objective, particularly a projection objective for use in semiconductor lithography, comprising optical elements such as lenses (16) and mirrors (11a). According to the invention, at least a portion of the optical elements (16, 11a) is provided with a reflective surface outside of the optically active area serving as the reference surface (12) for a the optical element inside the objective (8).

Abstract: An imaging device in a projection exposure machine for microlithography comprises at least one optical element and at least one manipulator, a linear drive for manipulating the position of the optical element. Said linear drive has at least one moving element, said moving element having a shearing part and a lifting part. Said shearing part is arranged to move the optical element and said lifting part is arranged to move said shearing part. Said linear drive has a supporting element which is in contact with and prevents movement of the optical element while the shearing part is moved by the lifting part.

Abstract: The invention relates to a device for holding a beam splitter element having an optically active beam splitter layer in an optical imaging device, the beam splitter element being connected to at least one support element that is fastened in the housing of the imaging device. The connection between the beam splitter element and said at least one support element is designed in such a way that the position of the beam splitter layer of the beam splitter element remains nearly constant relative to the housing independently of temperatures and of thermal stresses acting upon the beam splitter element.