Patents by Inventor Alexander Kospach

Alexander Kospach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11410909
    Abstract: A fluid channel for a power semiconductor module includes a die carrier configured to carry a plurality of semiconductor dies on a first side, a plurality of cooling elements arranged on a second side of the die carrier opposite the first side, and a channel wall arranged opposite the second side of the die carrier and forming a cavity. The cooling elements are arranged in the cavity. The cooling elements are attached to the die carrier at attachment points. A majority of the attachment points are positioned vertically in alignment with positions of the semiconductor dies.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: August 9, 2022
    Assignee: Infineon Technologies AG
    Inventors: Christian Schweikert, Alexander Kospach, Sebastian Paul Hans Moeller, Benedikt Rabl
  • Publication number: 20210175151
    Abstract: A fluid channel for a power semiconductor module includes a die carrier configured to carry a plurality of semiconductor dies on a first side, a plurality of cooling elements arranged on a second side of the die carrier opposite the first side, and a channel wall arranged opposite the second side of the die carrier and forming a cavity. The cooling elements are arranged in the cavity. The cooling elements are attached to the die carrier at attachment points. A majority of the attachment points are positioned vertically in alignment with positions of the semiconductor dies.
    Type: Application
    Filed: November 24, 2020
    Publication date: June 10, 2021
    Inventors: Christian Schweikert, Alexander Kospach, Sebastian Paul Hans Moeller, Benedikt Rabl