Patents by Inventor Alexander LANDEL

Alexander LANDEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variation of metal layer stack under under bump metallization (UBM)
    Patent number: 11894829
    Abstract: In certain aspects, a chip includes a pad, and a first passivation layer, wherein a first portion of the first passivation layer extends over a first portion of the pad. The chip also includes a first metal layer between the first portion of the pad and the first portion of the first passivation layer. The chip further includes an under bump metallization (UBM) electrically coupled to a second portion of the pad.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: February 6, 2024
    Assignee: RF360 Singapore Pte. Ltd.
    Inventors: Ute Steinhaeusser, Niklaas Konopka, Alexander Landel
  • VARIATION OF METAL LAYER STACK UNDER UNDER BUMP METALLIZATION (UBM)
    Publication number: 20210143790
    Abstract: In certain aspects, a chip includes a pad, and a first passivation layer, wherein a first portion of the first passivation layer extends over a first portion of the pad. The chip also includes a first metal layer between the first portion of the pad and the first portion of the first passivation layer. The chip further includes an under bump metallization (UBM) electrically coupled to a second portion of the pad.
    Type: Application
    Filed: April 21, 2020
    Publication date: May 13, 2021
    Inventors: Ute STEINHAEUSSER, Niklaas KONOPKA, Alexander LANDEL