Abstract: According to some embodiments, a device includes: a magnetic field current sensor magnetically coupled to a conductor and configured to generate a magnetic field signal having a magnitude responsive to a current flowing through the conductor; a shunt interface having first and second input terminals electrically coupled to ends of a shunt disposed along the conductor, the shunt interface configured to generate a shunt signal having a magnitude responsive to the current flowing through the conductor; and a diagnostic circuit configured to receive the magnetic field signal and the shunt signal and to generate a fault signal based on a comparison between the magnitude of the magnetic field signal and the magnitude of the shunt signal.

Abstract: A sensor includes a sensing element configured to generate a sensing element output signal indicative of a sensed parameter and a signal path responsive to the sensing element output signal and having at least one of an adjustable gain or an adjustable offset, wherein the signal path is configured to generate a sensor output signal indicative of the sensed parameter. A supply voltage detector is configured to generate a supply voltage signal indicative of which of a plurality of voltage ranges a supply voltage of the sensor falls within and at least one of the adjustable gain or the adjustable offset is adjustable in response to the supply voltage signal.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. Each of the input portion and output portion of the primary conductor is exposed from orthogonal sides of the package body. A fault signal may be provided to indicate an overcurrent condition in the integrated current sensor package. The primary current path may be made of a thick lead frame material to reduce the primary current path resistance.

Abstract: A magnetic field sensor includes at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element responsive to a sensing element drive signal and configured to detect a directly coupled magnetic field generated by the at least one coil and to generate a magnetic field signal in response to the directly coupled magnetic field; a processor responsive to the magnetic field signal to compute a sensitivity value associated with detection of the directly coupled magnetic field and substantially independent of a reflected magnetic field reflected by a conductive target disposed proximate to the at least one magnetic field sensing element; and an output signal generator configured to generate an output signal of the magnetic field sensor indicative of the reflected magnetic field.

Abstract: According to some embodiments, a device includes: a magnetic field current sensor magnetically coupled to a conductor and configured to generate a magnetic field signal having a magnitude responsive to a current flowing through the conductor; a shunt interface having first and second input terminals electrically coupled to ends of a shunt disposed along the conductor, the shunt interface configured to generate a shunt signal having a magnitude responsive to the current flowing through the conductor; and a diagnostic circuit configured to receive the magnetic field signal and the shunt signal and to generate a fault signal based on a comparison between the magnitude of the magnetic field signal and the magnitude of the shunt signal.

Abstract: A magnetic field sensor includes at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element responsive to a sensing element drive signal and configured to detect a directly coupled magnetic field generated by the at least one coil and to generate a magnetic field signal in response to the directly coupled magnetic field; a processor responsive to the magnetic field signal to compute a sensitivity value associated with detection of the directly coupled magnetic field and substantially independent of a reflected magnetic field reflected by a conductive target disposed proximate to the at least one magnetic field sensing element; and an output signal generator configured to generate an output signal of the magnetic field sensor indicative of the reflected magnetic field.

Abstract: Methods and apparatus for measuring a current difference between at least two primary current paths in a current sensor integrated circuit package. Each primary current path generated a magnetic field which may then be measured by at least one magnetic field sensing element positioned on an integrated circuit die. An output disconnect signal may be provided from the current sensor integrated circuit package when a current difference above a predetermined threshold exists in the two or more current traces.

Abstract: A network-accessible service such as a web site may authenticate users through a login process. In order to detect possibly fraudulent login events, the service may implement a framework based on recorded login events. For example, attributes of multiple recorded login events may be analyzed to create a framework that can be applied to attributes of newly received login requests to predict whether the newly received login requests are fraudulent. The framework may comprise criteria, algorithms, rules, models, and/or techniques, and may be constructed using various means such as pattern recognition, machine learning, and/or cluster analysis.

Abstract: A current sensor includes a lead frame having a plurality of leads, at least two of which form a current conductor configured to carry a current that generates a magnetic field and a substrate having first and second opposing surfaces, the first surface proximate to said current conductor and the second surface distal from the current conductor. A first magnetic field transducer is disposed on the substrate and a first coil is disposed on the substrate adjacent to the first magnetic field transducer, wherein the first magnetic field transducer and the first coil are positioned on a first side of the current conductor. A second magnetic field transducer is disposed on the substrate and a second coil is disposed on the substrate adjacent to the second magnetic field transducer, wherein the second magnetic field transducer and the second coil are positioned on a second side of the current conductor.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: Apparatus includes a first portion of conductive material having varying response to a generated magnetic field along a length of the conductive material, wherein the first portion of conductive material produces a varying eddy current and a varying reflected magnetic field, in response to the generated magnetic field. The apparatus further includes one or more reference portions of conductive material having a relatively invariable response to the generated magnetic field, wherein the reference portion of conductive material produces a relatively invariable eddy current and a relatively invariable reflected magnetic field in response to the generated magnetic field.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: Methods and apparatus for providing a high isolation current sensor. In embodiments, a current sensor includes a leadframe having a current conductor first portion and a second portion, a magnetic field sensing element positioned in relation to the current conductor for detecting a magnetic generated by current flow through the current conductor, and a die supported by at least a portion of the first and/or second portions of the leadframe, wherein the first portion of the lead frame includes an isolation region aligned with a first edge of the die. In embodiments, a current sensor includes SOI processing and features to enhance active layer isolation.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: A magnetic field sensor comprises a first coil configured to generate a magnetic field having a first frequency and induce a reflected magnetic field from a target. A second coil configured to generate a diagnostic magnetic field having a second frequency is included. The diagnostic magnetic field is configured not to induce a reflected magnetic field from the target that is measurable by the magnetic field sensor. At least two magnetic field sensing elements detect the reflected magnetic field and the diagnostic magnetic field and generate a signal representing the reflected magnetic field and the diagnostic magnetic field. A processing circuit is coupled to the at least two magnetic field sensing elements and configured to receive the signal, extract a diagnostic magnetic field portion of the signal representing the diagnostic magnetic field, and generate an error signal if a fault is detected.

Abstract: Methods and apparatus for providing data transfer with a drive coil to transmit information, a receive coil magnetically coupled to the drive coil, and a first magnetoresistive sensor proximate the receive coil to detect information from the receive coil. In embodiments, the drive and receive coils are separated by an isolation material. In embodiments, a signal isolator IC packages includes transmit and receive coils and a magnetic field sensing element coupled to the receive coil.

Abstract: Methods and apparatus for a sensor with a main coil to direct a magnetic field at a rotating target for inducing eddy currents in an end of the target and a sensing element to detect a magnetic field reflected from the target, wherein the target end comprises a conductive surface. The reflected magnetic field can be processed to determine an angular position of the target.

Abstract: A current sensor can indirectly measure a sensed current by directly measuring static perturbing AC magnetic fields with magnetoresistance elements, the perturbing magnetic fields generated by perturbing coils. The sensed current can be indirectly measured by modulating or changing sensitivities of the magnetoresistance elements in a way that is directly related to the sensed current.