Patents by Inventor Alexander Leon

Alexander Leon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250337702
    Abstract: There are provided systems and methods for message data placeholders for replacement in data elements with stylized components during message communications. A service provider may provide communications and computing services to users. When communicating with users, electronic messages may be sent, such as emails to assist users with use of services of the service provider. The service provider may provide a message template manager, where users may utilize the manager to select message templates to construct messages. The users may add text data and syntax for placeholders, where the syntax may be executed by code or other logic to replace the placeholders with corresponding data from data sources. When replacing and inserting data to be rendered in messages, the data may be checked for whether the data is from a source that is trusted, and, if not, may be prevented from being rendered in the message.
    Type: Application
    Filed: May 12, 2025
    Publication date: October 30, 2025
    Inventor: Alexander LEON
  • Patent number: 12301521
    Abstract: There are provided systems and methods for message data placeholders for replacement in data elements with stylized components during message communications. A service provider may provide communications and computing services to users. When communicating with users, electronic messages may be sent, such as emails to assist users with use of services of the service provider. The service provider may provide a message template manager, where users may utilize the manager to select message templates to construct messages. The users may add text data and syntax for placeholders, where the syntax may be executed by code or other logic to replace the placeholders with corresponding data from data sources. When replacing and inserting data to be rendered in messages, the data may be checked for whether the data is from a source that is trusted, and, if not, may be prevented from being rendered in the message.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: May 13, 2025
    Assignee: Brex Inc.
    Inventor: Alexander Leon
  • Publication number: 20250080478
    Abstract: There are provided systems and methods for message data placeholders for replacement in data elements with stylized components during message communications. A service provider may provide communications and computing services to users. When communicating with users, electronic messages may be sent, such as emails to assist users with use of services of the service provider. The service provider may provide a message template manager, where users may utilize the manager to select message templates to construct messages. The users may add text data and syntax for placeholders, where the syntax may be executed by code or other logic to replace the placeholders with corresponding data from data sources. When replacing and inserting data to be rendered in messages, the data may be checked for whether the data is from a source that is trusted, and, if not, may be prevented from being rendered in the message.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 6, 2025
    Inventor: Alexander Leon
  • Publication number: 20240411510
    Abstract: An audio file distribution system may include a server configured to aggregate and store audio files in a database, and computing devices. The computing device may be configured to render an audio playback GUI on the display for playing a given audio file from the database, the audio playback GUI having a playback control user input, and an audio snippet creation user input, and when the audio snippet creation user input is activated, render an audio snippet creation GUI for the server to generate an audio snippet of the given audio file. The server may be configured to add the audio snippet of the given audio file to the database having audio snippets, generate a custom link to externally access the audio snippet within the database, and rank the audio snippet along with other audio snippets based upon heuristics data from respective users of the computing devices.
    Type: Application
    Filed: August 19, 2024
    Publication date: December 12, 2024
    Inventors: STUART M. GOFFMAN, ALEXANDER LEON, KIM SWEERS
  • Patent number: 11886497
    Abstract: An audio podcast distribution system includes a server configured to aggregate and store podcast audio files in a database. A computing device is configured to render an audio playback GUI on a display for playing a given podcast audio file from the database. The audio playback GUI includes a playback control user input, and an audio snippet creation user input. The computing device is configured to render an audio snippet playback GUI on the display, the audio snippet playback GUI include a video creation user input, and when the video creation user input is activated, send a video request to the server. The server is configured to, based upon the video request, generate a video file having the audio snippet of the given podcast audio file, and image data in the database associated with the given podcast audio file.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: January 30, 2024
    Assignee: PICKED CHERRIES INC.
    Inventors: Stuart M. Goffman, Alexander Leon
  • Publication number: 20230350942
    Abstract: An audio podcast distribution system includes a server configured to aggregate and store podcast audio files in a database. A computing device is configured to render an audio playback GUI on a display for playing a given podcast audio file from the database. The audio playback GUI includes a playback control user input, and an audio snippet creation user input. The computing device is configured to render an audio snippet playback GUI on the display, the audio snippet playback GUI include a video creation user input, and when the video creation user input is activated, send a video request to the server. The server is configured to, based upon the video request, generate a video file having the audio snippet of the given podcast audio file, and image data in the database associated with the given podcast audio file.
    Type: Application
    Filed: April 10, 2023
    Publication date: November 2, 2023
    Inventors: STUART M. GOFFMAN, RICK CIKOWSKI, JASON INASI, ALEXANDER LEON
  • Patent number: 8253430
    Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: August 28, 2012
    Assignee: Hewlett-Packard Development Company
    Inventor: Alexander Leon
  • Patent number: 8102057
    Abstract: Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: January 24, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alexander Leon, Rosa Reinosa, Michael David Carothers, Glen Griffiths
  • Patent number: 7954693
    Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.
    Type: Grant
    Filed: November 1, 2008
    Date of Patent: June 7, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Alexander Leon
  • Publication number: 20090058445
    Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.
    Type: Application
    Filed: October 14, 2008
    Publication date: March 5, 2009
    Inventor: Alexander Leon
  • Publication number: 20090051379
    Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.
    Type: Application
    Filed: November 1, 2008
    Publication date: February 26, 2009
    Inventor: Alexander Leon
  • Patent number: 7463046
    Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: December 9, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Alexander Leon
  • Patent number: 7461771
    Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including colinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: December 9, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Alexander Leon
  • Patent number: 7453278
    Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: November 18, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Alexander Leon
  • Publication number: 20080160252
    Abstract: Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue.
    Type: Application
    Filed: December 27, 2006
    Publication date: July 3, 2008
    Inventors: Alexander Leon, Rosa Reinosa, Michael David Carothers, Glen Griffiths
  • Publication number: 20070262784
    Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.
    Type: Application
    Filed: July 20, 2007
    Publication date: November 15, 2007
    Inventor: Alexander Leon
  • Publication number: 20070257687
    Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node.
    Type: Application
    Filed: July 12, 2007
    Publication date: November 8, 2007
    Inventor: Alexander Leon
  • Patent number: 7279912
    Abstract: Provided is a dual arcuate blade probe tip for probing a node, such as a node hole, on a circuit. The probe has a shaft made from an electrically conductive material, concentric to a longitudinal probe axis, and two separate arcuate edges coupled to the shaft and positioned transverse to the probe axis. The arcuate edges define a self-cleaning space therebetween, avoiding blockage of the probe by debris. The arcuate edges provide two single points of contact to concentrate applied force from the shaft to the node hole. The shaft may also include a plunger and/or a structure to prevent rotation of the probe about the probe axis.
    Type: Grant
    Filed: October 13, 2005
    Date of Patent: October 9, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Alexander Leon
  • Patent number: 7248065
    Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.
    Type: Grant
    Filed: September 6, 2005
    Date of Patent: July 24, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Alexander Leon
  • Publication number: 20070084903
    Abstract: Provided is a pronged fork probe tip for probing a node, such as a through-hole node, on a circuit. The probe tip has a shaft made from an electrically conductive material, concentric to a longitudinal probe axis, and two fork prongs coupled to the shaft and positioned parallel to the probe axis. The two fork prongs provide two geometrically singular points of contact, concentrating applied force from the shaft to the node hole, and more particularly, to solder within the node hole, at two points. A self-cleaning space between the fork prongs aids in preventing clogging of the probe by flux material and/or debris. The shaft may also include a plunger and/or a structure to provide a preferred fixed orientation by preventing rotation of the probe about the probe axis.
    Type: Application
    Filed: October 13, 2005
    Publication date: April 19, 2007
    Inventor: Alexander Leon