Patents by Inventor Alexander Leon
Alexander Leon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250337702Abstract: There are provided systems and methods for message data placeholders for replacement in data elements with stylized components during message communications. A service provider may provide communications and computing services to users. When communicating with users, electronic messages may be sent, such as emails to assist users with use of services of the service provider. The service provider may provide a message template manager, where users may utilize the manager to select message templates to construct messages. The users may add text data and syntax for placeholders, where the syntax may be executed by code or other logic to replace the placeholders with corresponding data from data sources. When replacing and inserting data to be rendered in messages, the data may be checked for whether the data is from a source that is trusted, and, if not, may be prevented from being rendered in the message.Type: ApplicationFiled: May 12, 2025Publication date: October 30, 2025Inventor: Alexander LEON
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Patent number: 12301521Abstract: There are provided systems and methods for message data placeholders for replacement in data elements with stylized components during message communications. A service provider may provide communications and computing services to users. When communicating with users, electronic messages may be sent, such as emails to assist users with use of services of the service provider. The service provider may provide a message template manager, where users may utilize the manager to select message templates to construct messages. The users may add text data and syntax for placeholders, where the syntax may be executed by code or other logic to replace the placeholders with corresponding data from data sources. When replacing and inserting data to be rendered in messages, the data may be checked for whether the data is from a source that is trusted, and, if not, may be prevented from being rendered in the message.Type: GrantFiled: August 29, 2023Date of Patent: May 13, 2025Assignee: Brex Inc.Inventor: Alexander Leon
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Publication number: 20250080478Abstract: There are provided systems and methods for message data placeholders for replacement in data elements with stylized components during message communications. A service provider may provide communications and computing services to users. When communicating with users, electronic messages may be sent, such as emails to assist users with use of services of the service provider. The service provider may provide a message template manager, where users may utilize the manager to select message templates to construct messages. The users may add text data and syntax for placeholders, where the syntax may be executed by code or other logic to replace the placeholders with corresponding data from data sources. When replacing and inserting data to be rendered in messages, the data may be checked for whether the data is from a source that is trusted, and, if not, may be prevented from being rendered in the message.Type: ApplicationFiled: August 29, 2023Publication date: March 6, 2025Inventor: Alexander Leon
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Publication number: 20240411510Abstract: An audio file distribution system may include a server configured to aggregate and store audio files in a database, and computing devices. The computing device may be configured to render an audio playback GUI on the display for playing a given audio file from the database, the audio playback GUI having a playback control user input, and an audio snippet creation user input, and when the audio snippet creation user input is activated, render an audio snippet creation GUI for the server to generate an audio snippet of the given audio file. The server may be configured to add the audio snippet of the given audio file to the database having audio snippets, generate a custom link to externally access the audio snippet within the database, and rank the audio snippet along with other audio snippets based upon heuristics data from respective users of the computing devices.Type: ApplicationFiled: August 19, 2024Publication date: December 12, 2024Inventors: STUART M. GOFFMAN, ALEXANDER LEON, KIM SWEERS
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Patent number: 11886497Abstract: An audio podcast distribution system includes a server configured to aggregate and store podcast audio files in a database. A computing device is configured to render an audio playback GUI on a display for playing a given podcast audio file from the database. The audio playback GUI includes a playback control user input, and an audio snippet creation user input. The computing device is configured to render an audio snippet playback GUI on the display, the audio snippet playback GUI include a video creation user input, and when the video creation user input is activated, send a video request to the server. The server is configured to, based upon the video request, generate a video file having the audio snippet of the given podcast audio file, and image data in the database associated with the given podcast audio file.Type: GrantFiled: April 10, 2023Date of Patent: January 30, 2024Assignee: PICKED CHERRIES INC.Inventors: Stuart M. Goffman, Alexander Leon
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Publication number: 20230350942Abstract: An audio podcast distribution system includes a server configured to aggregate and store podcast audio files in a database. A computing device is configured to render an audio playback GUI on a display for playing a given podcast audio file from the database. The audio playback GUI includes a playback control user input, and an audio snippet creation user input. The computing device is configured to render an audio snippet playback GUI on the display, the audio snippet playback GUI include a video creation user input, and when the video creation user input is activated, send a video request to the server. The server is configured to, based upon the video request, generate a video file having the audio snippet of the given podcast audio file, and image data in the database associated with the given podcast audio file.Type: ApplicationFiled: April 10, 2023Publication date: November 2, 2023Inventors: STUART M. GOFFMAN, RICK CIKOWSKI, JASON INASI, ALEXANDER LEON
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Patent number: 8253430Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.Type: GrantFiled: October 14, 2008Date of Patent: August 28, 2012Assignee: Hewlett-Packard Development CompanyInventor: Alexander Leon
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Patent number: 8102057Abstract: Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue.Type: GrantFiled: December 27, 2006Date of Patent: January 24, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alexander Leon, Rosa Reinosa, Michael David Carothers, Glen Griffiths
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Patent number: 7954693Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.Type: GrantFiled: November 1, 2008Date of Patent: June 7, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Publication number: 20090058445Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.Type: ApplicationFiled: October 14, 2008Publication date: March 5, 2009Inventor: Alexander Leon
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Publication number: 20090051379Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.Type: ApplicationFiled: November 1, 2008Publication date: February 26, 2009Inventor: Alexander Leon
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Patent number: 7463046Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.Type: GrantFiled: July 20, 2007Date of Patent: December 9, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Patent number: 7461771Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including colinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.Type: GrantFiled: April 22, 2005Date of Patent: December 9, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Patent number: 7453278Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node.Type: GrantFiled: July 12, 2007Date of Patent: November 18, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Publication number: 20080160252Abstract: Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue.Type: ApplicationFiled: December 27, 2006Publication date: July 3, 2008Inventors: Alexander Leon, Rosa Reinosa, Michael David Carothers, Glen Griffiths
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Publication number: 20070262784Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.Type: ApplicationFiled: July 20, 2007Publication date: November 15, 2007Inventor: Alexander Leon
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Publication number: 20070257687Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node.Type: ApplicationFiled: July 12, 2007Publication date: November 8, 2007Inventor: Alexander Leon
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Patent number: 7279912Abstract: Provided is a dual arcuate blade probe tip for probing a node, such as a node hole, on a circuit. The probe has a shaft made from an electrically conductive material, concentric to a longitudinal probe axis, and two separate arcuate edges coupled to the shaft and positioned transverse to the probe axis. The arcuate edges define a self-cleaning space therebetween, avoiding blockage of the probe by debris. The arcuate edges provide two single points of contact to concentrate applied force from the shaft to the node hole. The shaft may also include a plunger and/or a structure to prevent rotation of the probe about the probe axis.Type: GrantFiled: October 13, 2005Date of Patent: October 9, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Patent number: 7248065Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.Type: GrantFiled: September 6, 2005Date of Patent: July 24, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Publication number: 20070084903Abstract: Provided is a pronged fork probe tip for probing a node, such as a through-hole node, on a circuit. The probe tip has a shaft made from an electrically conductive material, concentric to a longitudinal probe axis, and two fork prongs coupled to the shaft and positioned parallel to the probe axis. The two fork prongs provide two geometrically singular points of contact, concentrating applied force from the shaft to the node hole, and more particularly, to solder within the node hole, at two points. A self-cleaning space between the fork prongs aids in preventing clogging of the probe by flux material and/or debris. The shaft may also include a plunger and/or a structure to provide a preferred fixed orientation by preventing rotation of the probe about the probe axis.Type: ApplicationFiled: October 13, 2005Publication date: April 19, 2007Inventor: Alexander Leon