Patents by Inventor Alexander Leon
Alexander Leon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240104502Abstract: Disclosed herein is a networked computer system, method, and computer program product for forming a consortium of a general contractor and subcontractors in an online work platform that enter into a contract with a client to complete a work project. In an embodiment, the consortium is a single legal entity with liability protection for the consortium (e.g., a registered LLC). The system processor automatedly generates a signed client's contract and signed subcontractors' contracts with the consortium when the client transmits approval of a general contractor's draft proposal. When the work project is amended, such as by adding a milestone or task, the system processor automatedly generates signed addendums to the client's contract with the consortium, and between the general contractor/consortium and existing subcontractor(s), or generates a new signed contract if a new subcontractor is hired. The system then generates and stores a PDF version of the signed contracts with addendums.Type: ApplicationFiled: September 22, 2023Publication date: March 28, 2024Applicant: Vicoland GmbHInventors: Javier Diaz Jimenez, Alexander McCullagh, Enrique Leon-Prado, Andreas Habsburg-Lothringen
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Patent number: 11911557Abstract: A heating element for a vaporizer cartridge is provided. The vaporizer cartridge may include a reservoir containing vaporizable material and a wicking element in fluid communication with the reservoir. The heating element may include a heating portion, a cartridge contact, and a leg. The heating portion includes at least two tines spaced apart from one another. The cartridge contact may be in in electrical communication with a power source. The leg extends between the heating portion and the cartridge contact. The heating portion may be crimped around the wicking element such that the heating portion secures the wicking element to the heating element and contacts at least two surfaces of the wicking element.Type: GrantFiled: January 28, 2021Date of Patent: February 27, 2024Assignee: JUUL Labs, Inc.Inventors: Ariel Atkins, Christopher L. Belisle, Steven Christensen, Alexander M. Hoopai, Eric Joseph Johnson, Jason King, Esteban Leon Duque, Christopher James Rosser
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Patent number: 11886497Abstract: An audio podcast distribution system includes a server configured to aggregate and store podcast audio files in a database. A computing device is configured to render an audio playback GUI on a display for playing a given podcast audio file from the database. The audio playback GUI includes a playback control user input, and an audio snippet creation user input. The computing device is configured to render an audio snippet playback GUI on the display, the audio snippet playback GUI include a video creation user input, and when the video creation user input is activated, send a video request to the server. The server is configured to, based upon the video request, generate a video file having the audio snippet of the given podcast audio file, and image data in the database associated with the given podcast audio file.Type: GrantFiled: April 10, 2023Date of Patent: January 30, 2024Assignee: PICKED CHERRIES INC.Inventors: Stuart M. Goffman, Alexander Leon
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Publication number: 20230350942Abstract: An audio podcast distribution system includes a server configured to aggregate and store podcast audio files in a database. A computing device is configured to render an audio playback GUI on a display for playing a given podcast audio file from the database. The audio playback GUI includes a playback control user input, and an audio snippet creation user input. The computing device is configured to render an audio snippet playback GUI on the display, the audio snippet playback GUI include a video creation user input, and when the video creation user input is activated, send a video request to the server. The server is configured to, based upon the video request, generate a video file having the audio snippet of the given podcast audio file, and image data in the database associated with the given podcast audio file.Type: ApplicationFiled: April 10, 2023Publication date: November 2, 2023Inventors: STUART M. GOFFMAN, RICK CIKOWSKI, JASON INASI, ALEXANDER LEON
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Patent number: 10304997Abstract: A device includes a substrate (10) and a III-nitride structure (15) grown on the substrate, the III-nitride structure comprising a light emitting layer (16) disposed between an n-type region (14) and a p-type region (18). The substrate is a RA03 (MO)n where R is one of a trivalent cation: Sc, In, Y and a lanthanide; A is one of a trivalent cation: Fe (III), Ga and Al; M is one for a divalent cation: Mg, Mn, Fe (II), Co, Cu, Zn and Cd; and n is an integer?1. The substrate has an inplane lattice constant asubstrate. At lease one III-nitride layer in the III-nitride structure has a bulk lattice constant alayer such that [(|asubstrate?alayer|)/asubstrate]*100% is no more than 1%.Type: GrantFiled: October 27, 2011Date of Patent: May 28, 2019Assignee: Lumileds LLCInventors: Michael Jason Grundmann, Nathan Frederick Gardner, Werner Karl Goetz, Melvin Barker McLaurin, John Edward Epler, Francisco Alexander Leon
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Publication number: 20150115299Abstract: A device includes a substrate (10) and a III-nitride structure (15) grown on the substrate, the III-nitride structure comprising a light emitting layer (16) disposed between an n-type region (14) and a p-type region (18). The substrate is a RAO3 (MO)n where R is one of a trivalent cation: Sc, In, Y and a lanthanide; A is one of a trivalent cation: Fe (III), Ga and Al; M is one for a divalent cation: Mg, Mn, Fe (II), Co, Cu, Zn and Cd; and n is an integer ?1. The substrate has an inplane lattice constant asubstrate. At lease one III-nitride layer in the III-nitride structure has a bulk lattice constant alayer such that [(|asubstrate?alayer|)/asubstrate]*100% is no more than 1%.Type: ApplicationFiled: October 27, 2011Publication date: April 30, 2015Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Michael Jason Grundmann, Nathan Frederick Gardner, Werner Karl Goetz, Melvin Barker Mclaurin, John Edward Epler, Francisco Alexander Leon
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Patent number: 8253430Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.Type: GrantFiled: October 14, 2008Date of Patent: August 28, 2012Assignee: Hewlett-Packard Development CompanyInventor: Alexander Leon
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Patent number: 8102057Abstract: Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue.Type: GrantFiled: December 27, 2006Date of Patent: January 24, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alexander Leon, Rosa Reinosa, Michael David Carothers, Glen Griffiths
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Patent number: 7954693Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.Type: GrantFiled: November 1, 2008Date of Patent: June 7, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Publication number: 20090058445Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.Type: ApplicationFiled: October 14, 2008Publication date: March 5, 2009Inventor: Alexander Leon
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Publication number: 20090051379Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.Type: ApplicationFiled: November 1, 2008Publication date: February 26, 2009Inventor: Alexander Leon
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Patent number: 7461771Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including colinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.Type: GrantFiled: April 22, 2005Date of Patent: December 9, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Patent number: 7463046Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.Type: GrantFiled: July 20, 2007Date of Patent: December 9, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Patent number: 7453278Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node.Type: GrantFiled: July 12, 2007Date of Patent: November 18, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Publication number: 20080160252Abstract: Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue.Type: ApplicationFiled: December 27, 2006Publication date: July 3, 2008Inventors: Alexander Leon, Rosa Reinosa, Michael David Carothers, Glen Griffiths
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Publication number: 20070262784Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.Type: ApplicationFiled: July 20, 2007Publication date: November 15, 2007Inventor: Alexander Leon
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Publication number: 20070257687Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node.Type: ApplicationFiled: July 12, 2007Publication date: November 8, 2007Inventor: Alexander Leon
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Patent number: 7279912Abstract: Provided is a dual arcuate blade probe tip for probing a node, such as a node hole, on a circuit. The probe has a shaft made from an electrically conductive material, concentric to a longitudinal probe axis, and two separate arcuate edges coupled to the shaft and positioned transverse to the probe axis. The arcuate edges define a self-cleaning space therebetween, avoiding blockage of the probe by debris. The arcuate edges provide two single points of contact to concentrate applied force from the shaft to the node hole. The shaft may also include a plunger and/or a structure to prevent rotation of the probe about the probe axis.Type: GrantFiled: October 13, 2005Date of Patent: October 9, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Patent number: 7248065Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.Type: GrantFiled: September 6, 2005Date of Patent: July 24, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventor: Alexander Leon
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Publication number: 20070084903Abstract: Provided is a pronged fork probe tip for probing a node, such as a through-hole node, on a circuit. The probe tip has a shaft made from an electrically conductive material, concentric to a longitudinal probe axis, and two fork prongs coupled to the shaft and positioned parallel to the probe axis. The two fork prongs provide two geometrically singular points of contact, concentrating applied force from the shaft to the node hole, and more particularly, to solder within the node hole, at two points. A self-cleaning space between the fork prongs aids in preventing clogging of the probe by flux material and/or debris. The shaft may also include a plunger and/or a structure to provide a preferred fixed orientation by preventing rotation of the probe about the probe axis.Type: ApplicationFiled: October 13, 2005Publication date: April 19, 2007Inventor: Alexander Leon