Abstract: A semiconductor substrate centering mechanism includes a plurality of substrate support pins, each pin having a top surface. The top surfaces of the pins define a plane in which the substrate is supported. Each pin has a tab mounted eccentrically at the top surface of the pin. The tabs extend upwardly relative to the top surfaces of the pins. The centering mechanism further includes a pin rotation mechanism adapted to rotate each pin. The pin rotation mechanism rotates the pins between a first position in which the tabs define an envelope that is larger than a circumference of the substrate and a second position in which the tabs define a centered position for the substrate. A telescoping arrangement of nesting shield segments may also be provided for each pin to prevent processing fluid from reaching a shaft of the pin.

Abstract: A roller assembly is provided. The roller assembly comprises a groove that includes two opposing surfaces. The roller assembly comprises either frictional surfaces positioned along the groove, or O-ring(s) coupled to the groove. The frictional surfaces may be a plurality of holes at spaced intervals along the opposing surfaces of the groove, a plurality of holes, each hole sized so as to extend into the two opposing surfaces, at spaced intervals along the opposing surfaces of the groove, or may be a bead-blasted surface or a knurled surface positioned along the opposing surfaces of the groove.

Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

Abstract: Methods and apparatus, including computer program products, implementing and using techniques for selectively accessing one or more web services from a client machine, the one or more web services and the client machine being accessible over a network. A request for information is received from a client machine with a conversion engine. The request is received over a synchronous interface. The request is processed in the conversion engine. The processed request is transmitted over an asynchronous interface from the conversion engine to at least one web service. Methods and apparatus, including computer program products, for converting a web service description language file for a synchronous web service into a web service description language file for an asynchronous client machine are also described.

Abstract: In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.

Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

Abstract: A roller assembly is provided. The roller assembly comprises a groove that the includes two opposing surfaces. The roller assembly comprises either frictional surfaces positioned along the groove, or O-ring(s) coupled to the groove. The frictional surfaces may be a plurality of holes at spaced intervals along the opposing surfaces of the groove, a plurality of holes, each hole sized so as to extend into the two opposing surfaces, at spaced intervals along the opposing surfaces of the groove, or may be a bead-blasted surface or a knurled surface positioned along the opposing surfaces of the groove.

Abstract: A roller assembly is provided. The roller assembly comprises a groove that includes two opposing surfaces. The roller assembly comprises either frictional surfaces positioned along the groove, or O-ring(s) coupled to the groove. The frictional surfaces may be a plurality of holes at spaced intervals along the opposing surfaces of the groove, a plurality of holes, each hole sized so as to extend into the two opposing surfaces, at spaced intervals along the opposing surfaces of the groove, or may be a bead-blasted surface or a knurled surface positioned along the opposing surfaces of the groove.

Abstract: Methods and apparatus are described for facilitating communication among a plurality of entities via an interoperability network. Each entity has policy data corresponding thereto governing interaction with the entity via the interoperability network. A message is transmitted from a first one of the entities to a second one of the entities. The first entity has first policy data corresponding thereto and the second entity has second policy data corresponding thereto. The transmitted message was handled in the network according to combined policy data representing a combination of the first and second policy data.

Abstract: In a first aspect, a rotary vacuum-chuck is provided that may hold a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate. The chuck has one or more openings in fluid communication with the hollow rotary shaft. A venturi is formed near an end of the hollow rotary shaft to apply vacuum to the hollow rotary shaft and the openings in the chuck surface. No seal is required between the end of the hollow rotary shaft and a surrounding stationary block.

Abstract: A wafer scrubbing unit includes a mounting assembly for a scrubber brush. The mounting assembly has a rotary flow through tube through which cleaning liquid is delivered to the brush. A stationary tube may be mounted in the bore of the rotary tube. Spinning shields mounted on the rotary tube form labyrinth seals to protect a bearing housing from the cleaning liquid. Bearings for rotatably mounting the rotary tube are mounted within the housing.

Abstract: A method and apparatus is provided that may protect a fragile component (such as a quartz plate) positioned within a megasonic tank from impact by falling objects. The megasonic tank may include a barrier (such as one or more extended rollers, quartz bars, or a net) that is configured to protect the fragile component.

Abstract: A non-contact apparatus and method for removing a metal layer from a substrate are provided. The apparatus includes a rotatable anode substrate support member configured to support a substrate in a face-up position and to electrically contact the substrate positioned thereon. A pivotally mounted cathode fluid dispensing nozzle assembly positioned above the anode substrate support member is also provided. A power supply in electrical communication with the anode substrate support member and the cathode fluid dispensing nozzle is provided, and a system controller configured to regulate at least one of a rate of rotation of the anode substrate support member, a radial position of the cathode fluid dispensing nozzle, and an output power of the power supply is provided. The method provides for the removal of a metal layer from a substrate by rotating the substrate in a face up position on a rotatable substrate support member.

Abstract: A semiconductor substrate centering mechanism includes a plurality of substrate support pins, each pin having a top surface. The top surfaces of the pins define a plane in which the substrate is supported. Each pin has a tab mounted eccentrically at the top surface of the pin. The tabs extend upwardly relative to the top surfaces of the pins. The centering mechanism further includes a pin rotation mechanism adapted to rotate each pin. The pin rotation mechanism rotates the pins between a first position in which the tabs define an envelope that is larger than a circumference of the substrate and a second position in which the tabs define a centered position for the substrate. A telescoping arrangement of nesting shield segments may also be provided for each pin to prevent processing fluid from reaching a shaft of the pin.

Abstract: A rotary vacuum-chuck mounts a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate, the surface having one or more openings in fluid communication with the hollow rotary shaft. A vacuum generator evacuates the hollow rotary shaft and the one or more openings so as to vacuum chuck a substrate to the chuck surface. A labyrinthine gap is defined between a first member that rotates with the hollow rotary shaft and a second member that is stationary. A fluid in the labyrinthine gap provides a gas-tight seal between the first and second members.

Abstract: In a first aspect, a rotary vacuum-chuck is provided that may hold a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate. The chuck has one or more openings in fluid communication with the hollow rotary shaft. A venturi is formed near an end of the hollow rotary shaft to apply vacuum to the hollow rotary shaft and the openings in the chuck surface. No seal is required between the end of the hollow rotary shaft and a surrounding stationary block.

Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

Abstract: Tubular, endless body, adapted to be introduced into, advanced along, and retracted from a duct, particularly of the human body, which comprises, when distended by inner fluid pressure, an outer surface, an inner channel, and rounded (toroidal) ends connecting the said outer surface to the surface of said inner channel, and which comprises portions of different diameter when in distended condition.

Abstract: A rotary vacuum-chuck mounts a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate, the surface having one or more openings in fluid communication with the hollow rotary shaft. A vacuum generator evacuates the hollow rotary shaft and the one or more openings so as to vacuum chuck a substrate to the chuck surface. A labyrinthine gap is defined between a first member that rotates with the hollow rotary shaft and a second member that is stationary. A fluid in the labyrinthine gap provides a gas-tight seal between the first and second members.