Abstract: A power module includes a power unit. The power unit includes a power semiconductor and a substrate. In order to improve the reliability of the power module, the substrate of the power unit is directly connected in an integrally bonded manner to a surface of a heat sink. The power unit is surrounded at least partially by a housing. The housing includes a housing frame which is connected liquid-tight to the surface of the heat sink and formed from a first dielectric material, and a housing cover which is connected to the housing frame to close the housing and is formed from a second dielectric material.

Abstract: A method and a device (10) for welding at least two profiled sections (1) for window or door frames or leaves uses a heating unit (4) introduced between the profiled sections (2, 3) to be joined. At least two heating elements (5, 6) of the heating unit melt the profiled section ends (2, 3) at the end surfaces to be joined. In order to chamfer, in particular remove, a profiled section edge layer (20) of the profiled section ends (2, 3) along the layer surfaces (12, 13) thereof, at least one tool, in particular at least one cutting blade (7, 8), is arranged on the heating elements (5, 6) and is moved such that the material (9) to be melted is displaced into the profiled section interior (11) or into the interior (12) of the profiled section chambers (13). A compression device compresses the profiled section ends (2, 3).

Abstract: An arrangement for cooling a power module with at least one power unit in a housing is provide, the arrangement having at least one heat sink, in which the arrangement for cooling has at least one heat-sink cover, and at least a part of the power module, in particular the housing, at least a part of the heat sink and/or at least a part of the heat-sink cover are/is configured in such a way that, after attachment of the heat-sink cover, the heat sink is fixed in the housing, in particular by way of clamping, through interaction of the configuration of heat sink, heat-sink cover and/or housing. Also, a power module having such an arrangement for cooling a power module is provided.

Abstract: A semiconductor assembly includes a semiconductor module designed for connection to a heat sink and having a surface which faces away from the heat sink and has a depression, a printed circuit board, and an electronic circuit arranged on the printed circuit board. The printed circuit board together with the electronic circuit is secured to the semiconductor module on the surface of the semiconductor module. The electronic circuit includes electronic components configured to protrude into the depression of the semiconductor module.

Abstract: A power module includes at least two power units. Each power unit includes at least one power semiconductor and a substrate. In order to reduce the installation space required for the power module and to improve cooling, the at least one power semiconductor is connected, in particular in a materially bonded manner, to the substrate. The substrates of the at least two power units are each directly connected in a materially bonded manner to a surface of a common heat sink. A power converter having at least one power module is also disclosed.