Abstract: A slurry distribution system for distributing slurry to a polishing machine that polishes a semiconductor wafer is disclosed. The slurry distribution system includes a storage tank for storing the slurry, a mixing device for mixing the slurry in the storage tank, a distribution loop with an inlet and outlet in fluid communication with the storage tank, a valve in fluid communication with the distribution loop for dispensing the slurry to the polishing machine, and a pump for circulating the slurry from the storage tank through the distribution loop and into the storage tank regardless of whether the slurry is dispensed to the polishing machine. In this manner, the slurry is agitated and efficiently used during polishing and during intervals between polishing.

Abstract: An improved machine for performing a manufacturing process on a workpiece. The machine includes a cabinet defining an interior workspace for performing the manufacturing process. The workpiece is placed in the workspace by an operator. The cabinet is coupled with a gas source for receiving a flow of gas from the gas source. The improvement comprises a first aperture in the cabinet providing access to an interior chamber within the cabinet. The interior chamber has an interior surface and an open end aligned with the first aperture for storing a work-in-process unit. The interior chamber is accessible to the operator for transferring the work-in-process unit between the interior chamber and the workspace. The improvement further comprises a second aperture in the interior surface of the interior chamber, the second aperture admitting the flow of gas from the gas source to establish a laminar flow of the gas in the chamber intermediate the first aperture and the second aperture.