Abstract: The invention is related to the methods of solid bodies' thermophysical properties determination, particularly, to the methods of heat conduction and volumetric heat capacity determination. In accordance with the method heating of the reference sample and surface and sequentially located samples of the solid bodies in question is performed using a thermal energy source moving at a constant speed relative to the reference sample and samples-in-question. Excessive temperatures of the reference sample and samples-in-question at the points on the heating line are measured and by the excessive temperatures values the thermophysical properties are determined. Arbitrary shape samples are used and the samples' heat conduction and volumetric heat capacity are determined by solving the inverse-factor heat conduction problem.

Abstract: Method to determine the point of the gas leak from the buried pipeline located in the ditch under the soil, providing positioning at least one fiber-distributed temperature transmitter in the soil over the pipeline; the fiber-distributed temperature transmitter's readings allow to determine the leak point presence and location; the method is characterized by the fact that the fiber-distributed temperature transmitter is located above the pipeline surface; in the ground, between the pipeline and the transmitter or over the transmitter a shield is mounted which deflects the gas flow (in case of leakage) in the upper central part of the ditch adjacent to the transmitter and preventing the gas flow to the ditch peripheral areas located far away from the transmitter; the temperature is measured continuously and by the temperature drop the gas leak and its location is determined.

Abstract: Described is a catheter which includes a reinforced polymer shaft. The polymer includes nano particles having a dimension of less than about 6 nm. Described is also a method of forming a medical device. Granules of a selected polymer are prepared. Reinforced granules of the selected polymer are prepared. The reinforced granules include nano particles. The granules and the reinforced granules are then mixed in a ratio selected to obtain a desired concentration of the nano particles. The granules and the reinforced granules are extruded to form a substantially tubular element.

Abstract: Method declared in this invention relates to processing of 2D and 3D seismic exploration data. More particularly, it relates to the family of static correction methods used for delineation and compensation of near-surface heterogeneities. Time anomalies, caused by such heterogeneities, are detected, analyzed and removed from following processing sequence. If not removed, they mask useful information about true position of geological structures in time. Near surface anomalies are delineated via construction and interpretation of sets of surface-consistent time sections (2D) or cubes (3D), which are resulted from stacking seismic traces with common receiver point (CRP) or common source point (CSP). Combinations of different surface position of seismic sources and receivers on time sections are used to discriminate between surface anomaly and depth structure. Special case of time sections is the one where spatially fixed patterns of sources and receivers are used. This case is primarily used for 3D.

Abstract: A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

Abstract: A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith.

Abstract: A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.