Abstract: A network node (700) of a radio access network (RAN) of a wireless communication network (10) provides user plane security by establishing a secure tunnel between first and second tunnel endpoints (160, 180, 370, 195, 220, 230) that will handle respective protocol layers of a same protocol stack for a Data Radio Bearer (DRB) (330, 340, 350, 360) that is dedicated to user plane traffic and has yet to be established. Establishing the secure tunnel comprises exchanging an inner Internet Protocol (IP) address and an outer IP address of each of the endpoints (160, 180, 370, 195, 220, 230) between the endpoints (160, 180, 370, 195, 220, 230).

Abstract: A power semiconductor device comprising a power semiconductor module and a heat sink and a method for its manufacture. The heat sink has a first cooling housing component, with a cutout passing therethrough, and a second cooling housing component, with a cooling plate arranged in the cutout. The first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at the side of the cooling plate facing away from the power semiconductor components. The cooling plate is connected to the first cooling housing component by a first weld seam which extends circumferentially therearound. The first weld seam seals the cooling plate in relation to the first cooling housing component, and the second cooling housing component is connected to the first cooling housing component. The inventive power semiconductor device has good heat conduction from the power semiconductor components to a heat sink.

Abstract: A power semiconductor device comprising a power semiconductor module and a heat sink and a method for its manufacture. The heat sink has a first cooling housing component, with a cutout passing therethrough, and a second cooling housing component, with a cooling plate arranged in the cutout. The first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at the side of the cooling plate facing away from the power semiconductor components. The cooling plate is connected to the first cooling housing component by a first weld seam which extends circumferentially therearound. The first weld seam seals the cooling plate in relation to the first cooling housing component, and the second cooling housing component is connected to the first cooling housing component. The inventive power semiconductor device has good heat conduction from the power semiconductor components to a heat sink.