Abstract: A heat sink, particularly for the cooling of electronic structural elements, has a base body, on which the structural elements and a cooling element that carries off the heat are arranged next to one another. An enlargement of the heat transmission surfaces relative to the overall size of the cooling element, and a resulting higher cooling performance are achieved by means of the fact that the cooling element is developed as a bundle of ribs consisting of a plurality of sheets. The sheets are arranged essentially in parallel and at a distance to one another that is determined by the plate thickness and density of the bundle of ribs. The sheets are connected with one another at one of their longitudinal sides and the bundle of ribs forming the cooling element are connected with the base body in a material locking way via a solder connection or the like. This development of the heat sink permits an individualized design of the cooling element for the optimal removal of the heat generated by the components.