Patents by Inventor Alexander R. Lostetter

Alexander R. Lostetter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120009056
    Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.
    Type: Application
    Filed: September 19, 2011
    Publication date: January 12, 2012
    Inventors: DAVID J. MITCHELL, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander R. Lostetter, Brice McPherson, Bryon Western