Patents by Inventor Alexander Rogg

Alexander Rogg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11498878
    Abstract: The invention relates to a copper-ceramic composite, comprising a ceramic substrate, which contains aluminum oxide, a coating on the ceramic substrate made of copper or a copper alloy, wherein the aluminum oxide has an average grain form factor Ra(Al2O3), determined as an arithmetic average value from the form factors of the grains of the aluminum oxide, the copper or the copper alloy has an average grain form factor Ra(Cu), determined as an arithmetic average of the form factors of the grains of the copper or copper alloy, and the average grain form factors of the aluminum oxide and copper or copper alloy meet the following condition: 0.5?Ra(Al2O3)/Ra(Cu)?2.0.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: November 15, 2022
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Kai Herbst, Christian Muschelknautz, Alexander Rogg
  • Patent number: 11430741
    Abstract: A ceramic-metal substrate in which the ceramic substrate has a low content of an amorphous phase. The ceramic-metal substrate includes a ceramic substrate and on at least one side of the ceramic substrate a metallization. The ceramic-metal substrate has at least one scribing line, at least one cutting edge, or both at least one scribing line and at least one cutting edge. Amorphous phases extend parallel to the scribing line and/or the cutting edge in a width of at most 100 ?m or of at least 0.50 ?m.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: August 30, 2022
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Alexander Rogg, Bogdan Lisca
  • Patent number: 11383321
    Abstract: The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: July 12, 2022
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Alexander Rogg, Bogdan Lisca
  • Patent number: 11021407
    Abstract: The invention relates to a copper/ceramic composite comprising—a ceramic substrate which contains aluminum oxide, —a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Cu)=d50/darith; the aluminum oxide has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Al2O3)=d50/darith; and S(Al2O3) and S(Cu) satisfy the following condition: 0.7?S(Al2O3)/S(Cu)?1.4.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: June 1, 2021
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Kai Herbst, Christian Muschelknautz, Alexander Rogg
  • Publication number: 20200398372
    Abstract: The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.
    Type: Application
    Filed: June 21, 2018
    Publication date: December 24, 2020
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Alexander Rogg, Bogdan LISCA
  • Publication number: 20200308072
    Abstract: The invention relates to a copper/ceramic composite comprising—a ceramic substrate which contains aluminum oxide, —a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Cu)=d50/darith; the aluminum oxide has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Al2O3)=d50/darith; and S(Al2O3) and S(Cu) satisfy the following condition: 0.7<S(Al2O3)/S(Cu)?1.4.
    Type: Application
    Filed: February 16, 2017
    Publication date: October 1, 2020
    Inventors: KAI HERBST, Christian MUSCHELKNAUTZ, Alexander ROGG
  • Publication number: 20200098696
    Abstract: A ceramic-metal substrate in which the ceramic substrate has a low content of an amorphous phase. The ceramic-metal substrate includes a ceramic substrate and on at least one side of the ceramic substrate a metallization. The ceramic-metal substrate has at least one scribing line, at least one cutting edge, or both at least one scribing line and at least one cutting edge. Amorphous phases extend parallel to the scribing line and/or the cutting edge in a width of at most 100 ?m or of at least 0.50 ?m.
    Type: Application
    Filed: May 15, 2018
    Publication date: March 26, 2020
    Inventors: Alexander ROGG, Bogdan LISCA
  • Publication number: 20190055166
    Abstract: The invention relates to a copper-ceramic composite, comprising a ceramic substrate, which contains aluminum oxide, a coating on the ceramic substrate made of copper or a copper alloy, wherein the aluminum oxide has an average grain form factor Ra(Al2O3), determined as an arithmetic average value from the form factors of the grains of the aluminum oxide, the copper or the copper alloy has an average grain form factor Ra(Cu), determined as an arithmetic average of the form factors of the grains of the copper or copper alloy, and the average grain form factors of the aluminum oxide and copper or copper alloy meet the following condition: 0.5?Ra(Al2O3)/Ra(Cu)?2.0.
    Type: Application
    Filed: February 16, 2017
    Publication date: February 21, 2019
    Inventors: Kai Herbst, Christian Muschelknautz, Alexander ROGG
  • Publication number: 20190009362
    Abstract: One aspect relates to a method of processing metallized ceramic substrates and to a metal-ceramic substrate obtained by this method.
    Type: Application
    Filed: December 21, 2016
    Publication date: January 10, 2019
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Richard WACKER, Alexander ROGG
  • Patent number: 8377240
    Abstract: A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: February 19, 2013
    Assignee: Curamik Electronics GmbH
    Inventors: Jurgen Schulz-Harder, Andreas Karl Frischmann, Alexander Rogg, Karl Exel
  • Publication number: 20070261778
    Abstract: A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.
    Type: Application
    Filed: May 5, 2005
    Publication date: November 15, 2007
    Inventors: Jurgen Schulz-Harder, Andreas Frischmann, Alexander Rogg, Karl Exel