Abstract: A light emitting diode (LED) lightning module is disclosed. The LED lighting module includes a heat sink, a circuit board, a carrier, semiconductor chips such as LEDs arranged on an upper surface of the carrier, and at least one holding device pressing a lower surface of the substrate against an upper surface of the heat sink. The semiconductor chips are electrically connected to the carrier. The carrier is electrically connected to the circuit board.

Abstract: In at least one embodiment, an optoelectronic lighting module includes a circuit board, which an opening passes right through. The circuit board includes fastening devices for mechanically fastening the lighting module to an external heat sink. A carrier of the lighting module is mounted in the opening. At least one optoelectronic semiconductor chip is located on a carrier top and is connected electrically to the circuit board via the carrier. The circuit board is moreover connected firmly mechanically with the carrier. The circuit board is additionally designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink. The carrier is designed to rest with a carrier bottom flat against the external heat sink.

Abstract: In at least one embodiment of the optoelectronic lighting module the lighting module has a cooling body, a printed circuit board, and a substrate. One or more optoelectronic semiconductor chips is/are arranged on a substrate upper face. The semiconductor chips are electrically connected to the substrate. At least one retaining device lies directly or indirectly on the substrate upper face and presses a substrate lower face against a cooling body upper face. The substrate is electrically connected to the printed circuit board. The retaining device is electrically insulated from the at least one semiconductor chip.

Abstract: In at least one embodiment, an optoelectronic lighting module includes a circuit board, which an opening passes right through. The circuit board includes fastening devices for mechanically fastening the lighting module to an external heat sink. A carrier of the lighting module is mounted in the opening. At least one optoelectronic semiconductor chip is located on a carrier top and is connected electrically to the circuit board via the carrier. The circuit board is moreover connected firmly mechanically with the carrier. The circuit board is additionally designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink. The carrier is designed to rest with a carrier bottom flat against the external heat sink.