Abstract: A production method for a micromechanical sensor apparatus. The method includes: providing a bonded wafer stack comprising an ASIC wafer and a MEMS wafer, the ASIC wafer including ASIC switching devices and the MEMS wafer including MEMS sensor devices, an ASIC switching device and a corresponding MEMS sensor device are arranged one above the other such that they form a respective micromechanical sensor apparatus in the bonded wafer stack; providing a first packaging wafer having first front and rear faces; in the first rear face, the first packaging wafer has blind holes assigned to corresponding sensor detection regions of a respective MEMS sensor device; bonding the first rear face to the wafer stack such that the blind holes are each in fluid connection with the corresponding sensor detection region; backthinning, on the first front face, the first packaging wafer bonded to the wafer stack to expose the blind holes.

Abstract: A method for operating an emission certificate exchange platform involves balancing a positive pollutant balance of a motor vehicle using emission certificates. At least one operating parameter of the motor vehicle is transferred to an electronic computer unit of the emission certificate exchange platform outside of the motor vehicle. The positive pollutant balance of the motor vehicle is determined by the electronic computer unit depending on the operating parameter. At least one third party having a negative pollutant balance is identified by the electronic computer unit, and an emission certificate exchange is carried out between the motor vehicle and the third party by means of the emission certificate exchange platform.