Abstract: A system and method for detecting the presence of a voltage on a ground conductor which is coupled to a protective Earth (PE) terminal associated with a power source. The power source is used to apply a voltage to a device. The system may use a high impedance device coupled across a switch, with the switch being in communication with a portion of the device. A control system may monitor a voltage across the high impedance device and determine if the voltage across the high impedance device exceeds a predetermined threshold. Exceeding the predetermined threshold indicates that an unsafe voltage from the power source is present on the ground conductor. A natural high impedance path between the device and the Earth is used to provide an Earth connection through the device to the Earth during operation of the system.

Abstract: A system and method for detecting the presence of a voltage on a ground conductor which is coupled to a protective Earth (PE) terminal associated with a power source. The power source is used to apply a voltage to a device. The system may use a high impedance device coupled across a switch, with the switch being in communication with a portion of the device. A control system may monitor a voltage across the high impedance device and determine if the voltage across the high impedance device exceeds a predetermined threshold. Exceeding the predetermined threshold indicates that an unsafe voltage from the power source is present on the ground conductor. A natural high impedance path between the device and the Earth is used to provide an Earth connection through the device to the Earth during operation of the system.

Abstract: A semiconductor device for an automotive power control center. The device can include first, second and third legs, a semiconductor and an insulating material. The semiconductor is coupled to the legs and configured to transmit relatively high current power between the first and second legs in response to a control signal transmitted via the third leg. The insulating material can encapsulate the semiconductor and portions of the first and second legs. The insulating material can pass through one or more apertures formed in each of the first and second legs to aid in structurally interlocking the first and second legs to one another. A method for forming a semiconductor device is also provided.

Abstract: An automotive power control center that includes a housing, a first conductor coupled to the housing, a second conductor, a control circuit, which is coupled to the housing, and a semiconductor. The second conductor is coupled to the housing and insulated from the first conductor. The solid-state device includes a first terminal, which is electrically coupled to the first conductor, a second terminal, which is electrically coupled to the second conductor, and a third terminal, which is electrically coupled to the control circuit. The solid-state device is configured to selectively control transmission of electricity between the first and second terminals in response to a signal transmitted from the control circuit through the third terminal. In some embodiments the solid-state device may be removably coupled to the housing. In other embodiments, the solid-state device may be fixedly coupled to the various conductors and terminals.

Abstract: An automotive power control center that includes a housing, a first conductor coupled to the housing, a second conductor, a control circuit, which is coupled to the housing, and a semiconductor. The second conductor is coupled to the housing and insulated from the first conductor. The solid-state device includes a first terminal, which is electrically coupled to the first conductor, a second terminal, which is electrically coupled to the second conductor, and a third terminal, which is electrically coupled to the control circuit. The solid-state device is configured to selectively control transmission of electricity between the first and second terminals in response to a signal transmitted from the control circuit through the third terminal. In some embodiments the solid-state device may be removably coupled to the housing. In other embodiments, the solid-state device may be fixedly coupled to the various conductors and terminals.

Abstract: An automotive power control center that includes a housing, a first conductor coupled to the housing, a second conductor, a control circuit, which is coupled to the housing, and a semiconductor. The second conductor is coupled to the housing and insulated from the first conductor. The solid-state device includes a first terminal, which is electrically coupled to the first conductor, a second terminal, which is electrically coupled to the second conductor, and a third terminal, which is electrically coupled to the control circuit. The solid-state device is configured to selectively control transmission of electricity between the first and second terminals in response to a signal transmitted from the control circuit through the third terminal. In some embodiments the solid-state device may be removably coupled to the housing. In other embodiments, the solid-state device may be fixedly coupled to the various conductors and terminals.

Abstract: An automotive power control center that includes a housing, a first conductor coupled to the housing, a second conductor, a control circuit, which is coupled to the housing, and a semiconductor. The second conductor is coupled to the housing and insulated from the first conductor. The solid-state device includes a first terminal, which is electrically coupled to the first conductor, a second terminal, which is electrically coupled to the second conductor, and a third terminal, which is electrically coupled to the control circuit. The solid-state device is configured to selectively control transmission of electricity between the first and second terminals in response to a signal transmitted from the control circuit through the third terminal. In some embodiments the solid-state device may be removably coupled to the housing. In other embodiments, the solid-state device may be fixedly coupled to the various conductors and terminals.