Abstract: An inverter including a housing surrounding an internal space of the inverter. Two boards with power semiconductors disposed thereon are disposed in the internal space. A bracket serves to fix the inverter to a wall. An air intake port for taking in ambient air is disposed in a rear wall. A cooling channel closed with respect to the internal space and fluidly connected to the air intake port and an air exhaust port. A first fan generates an air flow in the cooling channel. Two heat sinks through which the air flow flows are disposed in the cooling channel. A heat sink is disposed on each of the two boards. The heat sinks and the boards are each electrically insulated from one another.