Patents by Inventor Alexander Spott

Alexander Spott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230261442
    Abstract: Semiconductor laser architectures that provide weak index guiding of interband cascade lasers (ICLs) processed on a native III-V substrate and of ICLs grown on GaAs or integrated on GaAs by heterogeneous bonding. Weak index guiding of a ridge waveguide semiconductor laser can enhance the stability of lasing in the fundamental lateral mode, so as to allow a wider ridge to maintain stable single-lateral-mode operation.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 17, 2023
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Jerry R. Meyer, Alexander Spott, Vijaysekhar Jayaraman, Chul Soo Kim, Mijin Kim, Chadwick L. Canedy, Charles D. Merritt, William W. Bewley, Igor Vurgaftman
  • Publication number: 20230231364
    Abstract: Semiconductor laser architectures that provide weak index guiding of interband cascade lasers (ICLs) processed on a native III-V substrate and of ICLs grown on silicon or integrated on silicon by heterogeneous bonding. Weak index guiding of a ridge waveguide semiconductor laser can enhance the stability of lasing in the fundamental lateral mode, so as to allow a wider ridge to maintain stable single-lateral-mode operation.
    Type: Application
    Filed: January 4, 2023
    Publication date: July 20, 2023
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Jerry R. Meyer, Alexander Spott, Chul Soo Kim, Mijin Kim, Chadwick L. Canedy, Charles D. Merritt, William W. Bewley, Igor Vurgaftman
  • Publication number: 20200185885
    Abstract: A light emitting device includes a unipolar light emitter structured from materials arranged to provide light emission via intersubband transitions of a single type of carrier in either of the conduction band or valence band integrated with a foreign surface.
    Type: Application
    Filed: May 18, 2018
    Publication date: June 11, 2020
    Inventors: Alan Young Liu, Alexander Spott, Arthur Gossard, John Bowers
  • Patent number: 9612398
    Abstract: An ultra-broadband photonic integrated circuit platform that combines at least two types of waveguides that each transmit in different, but overlapping, spectral bands on a single chip. By combining the multiple waveguides, the bandwidth of the platform can be extended beyond the bandwidth of either waveguide alone. In an exemplary embodiment, an ultra-broadband photonic integrated circuit includes a nitride-on-insulator (NOI) waveguide configured to transmit optical beams in a first spectral band and a silicon-on-nitride-on-insulator (SONOI) waveguide configured to transmit optical beams in a second band, where the same material serves as the core material in the NOI waveguide and as the cladding material in the SONOI waveguide. In some embodiments, light-emitting devices are bonded to an upper surface of the waveguides. In some embodiments, the circuit includes beam-combining elements so that a single beam combining all of the input wavelengths is output from the circuit.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: April 4, 2017
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Igor Vurgaftman, Jerry R. Meyer, Martijn Heck, Jock Bovington, Alexander Spott, Eric Stanton, John Bowers
  • Publication number: 20160109655
    Abstract: An ultra-broadband photonic integrated circuit platform that combines at least two types of waveguides that each transmit in different, but overlapping, spectral bands on a single chip. By combining the multiple waveguides, the bandwidth of the platform can be extended beyond the bandwidth of either waveguide alone. In an exemplary embodiment, an ultra-broadband photonic integrated circuit includes a nitride-on-insulator (NOI) waveguide configured to transmit optical beams in a first spectral band and a silicon-on-nitride-on-insulator (SONOI) waveguide configured to transmit optical beams in a second band, where the same material serves as the core material in the NOI waveguide and as the cladding material in the SONOI waveguide. In some embodiments, light-emitting devices are bonded to an upper surface of the waveguides. In some embodiments, the circuit includes beam-combining elements so that a single beam combining all of the input wavelengths is output from the circuit.
    Type: Application
    Filed: October 16, 2015
    Publication date: April 21, 2016
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Igor Vurgaftman, Jerry R. Meyer, Martijn Heck, Jock Bovington, Alexander Spott, Eric Stanton, John Bowers