Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: The present invention provides methods of generating short wavelength radiation, methods of transporting short wavelength radiation, and apparati used in these methods. One embodiment of the invention provides a method of transporting short wavelength radiation using a photonic band gap fiber. Another embodiment of the invention provides a method of transporting short wavelength radiation using a bundle of photonic band gap fibers. Another embodiment of the invention provides a method of generating ultraviolet radiation using high harmonic generation by pumping a noble gas-filled photonic band gap fiber with a pulsed laser source.

Abstract: Disclosed are systems and methods for cutting one or more glass sheets. A system is provided comprising a first mirror having a first reflective surface and a second reflective surface that is spaced from and opposes the first reflective surface to define a cavity between the mirrors. An aperture can be defined in the first mirror. Furthermore, a laser beam can be provided that is configured to emit a beam through the aperture into the cavity. Beams reflected in the cavity, in one aspect, define a common focus point through which the glass sheet can be translated to cause the cutting of the glass sheets. A means for translating the glass sheet through the cavity is provided, in one aspect.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: High-energy pulses of femtosecond lasers form cladding portions of waveguides in bulk glass by producing localized reductions in refractive index. The cladding portions written by the high-energy pulses circumscribe unexposed core portions for defining light-guiding pathways in the bulk glass.

Abstract: A combination of specific laser pulse durations and repetition rates are incorporated into a semiconductor wafer laser scribing/dicing process. The disclosed combination can reduce factors that contribute to thermal effects, explosive melting and evaporation, and laser/plasma interactions, thereby reducing problems with microcracks, delamination, and particles that can affect semiconductor die yields and reliability.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A method of making an at least one hole in an optically transparent body comprises the following steps: (i) providing an ultrashort pulse laser for producing a laser output with a wavelength ?, the laser output having a subpicosecond laser pulse duration; (ii) providing a laser output focusing lens for focusing the laser output, the focusing lens having a numerical aperture NA; (iii) providing an optically transparent body, the optically transparent body having a transparency at ? of at least 90%/cm; (iv) providing a liquid filled container situated proximate to the optically transparent body, such that the optically transparent body is in direct contact with the liquid; and (v) directing the laser output through the focusing lens to produce a focused laser output with a subpicosecond laser pulse duration proximate the optically transparent body, wherein the focused laser output traces at least one hole track pattern through the transparent glass body while the optically transparent body and said focused lase

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: The invention relates to methods of writing a light-guiding structure in a bulk glass substrate. The bulk glass substrate is preferably made from a soft silica-based material having an annealing point less than about 1380° K. A pulsed laser beam is focused within the substrate while the focus is translated relative to the substrate along a scan path at a scan speed effective to induce an increase in the refractive index of the material along the scan path. Substantially no laser-induced physical damage of the material is incurred along the scan path. Various optical devices can be made using this method.

Abstract: High-energy pulses of femtosecond lasers form cladding portions of waveguides in bulk glass by producing localized reductions in refractive index. The cladding portions written by the high-energy pulses circumscribe unexposed core portions for defining light-guiding pathways in the bulk glass.

Abstract: High-energy pulses of femtosecond lasers form cladding portions of waveguides in bulk glass by producing localized reductions in refractive index. The cladding portions written by the high-energy pulses circumscribe unexposed core portions for defining light-guiding pathways in the bulk glass.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device.

Abstract: A method of making an at least one hole in an optically transparent body comprises the following steps: (i) providing an ultrashort pulse laser for producing a laser output with a wavelength ?, the laser output having a subpicosecond laser pulse duration; (ii) providing a laser output focusing lens for focusing the laser output, the focusing lens having a numerical aperture NA; (iii) providing an optically transparent body, the optically transparent body having a transparency at ? of at least 90%/cm; (iv) providing a liquid filled container situated proximate to the optically transparent body, such that the optically transparent body is in direct contact with the liquid; and (v) directing the laser output through the focusing lens to produce a focused laser output with a subpicosecond laser pulse duration proximate the optically transparent body, wherein the focused laser output traces at least one hole track pattern through the transparent glass body while the optically transparent body and said focused lase

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: The present invention provides methods of generating short wavelength radiation, methods of transporting short wavelength radiation, and apparati used in these methods. One embodiment of the invention provides a method of transporting short wavelength radiation using a photonic band gap fiber. Another embodiment of the invention provides a method of transporting short wavelength radiation using a bundle of photonic band gap fibers. Another embodiment of the invention provides a method of generating ultraviolet radiation using high harmonic generation by pumping a noble gas-filled photonic band gap fiber with a pulsed laser source.