Abstract: The present disclosure provides a method for manufacturing a measurement probe, the method comprising cutting a carrier substrate to form a probe contour, the probe contour comprising at least one probe tip and a probe body, and metallizing the surface of the at least one probe tip of the probe contour. Further, the present disclosure provides a respective measurement probe.

Abstract: The present disclosure provides a differential measurement probe comprising a first support plate, a second support plate arranged in parallel to the first support plate, a first printed circuit probe tip that comprises a first contact section for contacting a device under test, and a second printed circuit probe tip that comprises a second contact section for contacting a device under test, wherein the first printed circuit probe tip and the second printed circuit probe tip are arranged between the first support plate and the second support plate and are mechanically supported by the first support plate and the second support plate.

Abstract: The present disclosure provides a method for manufacturing a measurement probe, the method comprising cutting a carrier substrate to form a probe contour, the probe contour comprising at least one probe tip and a probe body, and metallizing the surface of the at least one probe tip of the probe contour. Further, the present disclosure provides a respective measurement probe.

Abstract: Device and method for analyzing a probe, in particular for analyzing a symmetrical, differential probe. A ground-based test signal is provided to a main signal line, wherein the main signal line is terminated by a predetermined impedance. Furthermore, at least one additional signal line is provided, wherein a further impedance is arranged between the additional signal line and the ground. Accordingly, a differential probe may measure a differential signal between the main signal line and the additional signal line. Hence, no grounded signal is provided to the probe. This measurement of the probe can be compared with a reference signal directly acquired on the main signal line. In this way, characteristic values such as impedance and/or frequency response of the probe can be determined.

Abstract: A broadband connector system is provided. Said broadband connector system comprises a broadband socket connector comprising a socket strip conductor element comprising a socket lateral dimension, and a broadband plug connector comprising a plug strip conductor element comprising a plug lateral dimension. In this context, the broadband socket connector is connectable to the broadband plug connector, wherein the socket lateral dimension is greater or equal to the plug lateral dimension.

Abstract: Device and method for analyzing a probe, in particular for analyzing a symmetrical, differential probe. A ground-based test signal is provided to a main signal line, wherein the main signal line is terminated by a predetermined impedance. Furthermore, at least one additional signal line is provided, wherein a further impedance is arranged between the additional signal line and the ground. Accordingly, a differential probe may measure a differential signal between the main signal line and the additional signal line. Hence, no grounded signal is provided to the probe. This measurement of the probe can be compared with a reference signal directly acquired on the main signal line. In this way, characteristic values such as impedance and/or frequency response of the probe can be determined.

Abstract: A broadband connector system is provided. Said broadband connector system comprises a broadband socket connector comprising a socket strip conductor element comprising a socket lateral dimension, and a broadband plug connector comprising a plug strip conductor element comprising a plug lateral dimension. In this context, the broadband socket connector is connectable to the broadband plug connector, wherein the socket lateral dimension is greater or equal to the plug lateral dimension.