Patents by Inventor Alexander Szecket

Alexander Szecket has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5961027
    Abstract: A method of producing an hermetically sealed bond between a first metal and a second metal wherein the first metal comprises a first portion and a second portion, the method comprising (a) positioning the second portion and the second metal in generally spaced apart parallel relation; and (b) propelling the first portion into collision with the second metal so as to produce the hermetically sealed bond between the first portion and the second metal. The propulsion is preferably effected by a high velocity explosive charge of 5,500-9,000 m/s. The improved resultant bond is hermetically sealed. The process is of value in providing an hermetically sealed chamber, cavity or envelope having improved sealed properties.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: October 5, 1999
    Assignee: Sigma Technologies Corporation
    Inventor: Alexander Szecket
  • Patent number: 4842182
    Abstract: An improved process for metallugically bonding two layers of metal capable of forming brittle intermetallics, by means of propelling one of the layers progressively into collision along the other layer at a velocity and impact angle selected to produce a substantially straight bond along a common interfacial region of contact between the layers; and includes the welded product formed thereby.
    Type: Grant
    Filed: February 10, 1988
    Date of Patent: June 27, 1989
    Assignees: Alfredo Bentivoglio, Richardo Rodriquez, Alexander Szecket
    Inventor: Alexander Szecket
  • Patent number: 4747350
    Abstract: An improved process for metallurgically bonding two layers of metal capable of forming brittle intermetallics, by means of propelling one of the layers progressively into collision along the other layer at a velocity and impact angle selected to produce a waveless, complete metal to metal bond substantially free of the formation of brittle intermetallics along the entire interfacial region of contact between said layers; and includes the welded product formed thereby.
    Type: Grant
    Filed: March 11, 1985
    Date of Patent: May 31, 1988
    Assignees: Alexander Szecket, Alfredo Bentivoglio, Ricardo Rodriguez
    Inventor: Alexander Szecket