Patents by Inventor Alexander Talalaevski

Alexander Talalaevski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection device including one or more embedded vias and method of producing the same
    Patent number: 7608470
    Abstract: “An interconnection device comprises a Systems In Package (SIP) device, or Systems in Chip (SIC) device, including one or more embedded vias extending through a base substrate. A process to produce the interconnection device.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: October 27, 2009
    Assignee: Intel Corporation
    Inventors: Alexander Talalaevski, Eyal Bar-Sadeh, Shlomy Tubul
  • Interconnection device including one or more embedded vias and method of producing the same
    Publication number: 20060289995
    Abstract: Briefly, some demonstrative embodiments of the present invention include an interconnection device, e.g., a Systems In Package (SIP) device, or Systems In Chip (SIC) device, including one or more embedded vias. Some demonstrative embodiments of the invention include a process to produce the interconnection device. Other embodiments are described and claimed.
    Type: Application
    Filed: June 28, 2005
    Publication date: December 28, 2006
    Inventors: Alexander Talalaevski, Eyal Bar-Sadeh, Shlomy Tubul