Patents by Inventor Alexander Tsang

Alexander Tsang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11839043
    Abstract: An improved ECU for a motor vehicle comprises a housing that includes a top portion and a bottom portion each with an associated gasket. A printed circuit board (PCB) is enclosed between the housing portions. The gaskets provide seals between the housing, portions and respective sides of the PCB and apply balanced forces to each side to minimize strain on the PCB. One or both gaskets may be electromagnetic compliance gaskets.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: December 5, 2023
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: Hadwan Hadwan, John Janson, Ligor Manushi, Jeff Reuter, Jesus Antonio Marin Bello, Mark Ryskamp, Alexander Tsang, Andrew Yermak, Hiram Avalos, Kenneth Bouman
  • Patent number: 11581136
    Abstract: A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: February 14, 2023
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: Hadwan Hadwan, John Janson, Andrew Yermak, Alexander Tsang, Mark Ryskamp, Jesus Antonio Marin Bello, Jeff Reuter, Ligor Manushi
  • Publication number: 20220354011
    Abstract: An improved ECU for a motor vehicle comprises a housing that includes a top portion and a bottom portion each with an associated gasket. A printed circuit board (PCB) is enclosed between the housing portions. The gaskets provide seals between the housing, portions and respective sides of the PCB and apply balanced forces to each side to minimize strain on the PCB. One or both gaskets may be electromagnetic compliance gaskets.
    Type: Application
    Filed: April 29, 2021
    Publication date: November 3, 2022
    Inventors: Hadwan Hadwan, John Janson, Ligor Manushi, Jeff Reuter, Jesus Antonio Marin Bello, Mark Ryskamp, Alexander Tsang, Andrew Yermak, Hiram Avalos, Kenneth Bouman
  • Patent number: 11444394
    Abstract: A capacitor carrier assembly includes a carrier, a capacitor disposed in the carrier and electrically conductive connection terminals. The connection terminals support the carrier with respect to another electronic component or device such as a printed circuit board, retain individual carrier portions in an assembled configuration, and provide an electrical connection between the capacitor and the electronic component. Each connection terminal includes an elastic member that protrudes from a surface of the connection terminal and engages the carrier, and regions of serrations provided on opposed edges of the terminal that engage the carrier, and a flange that protrudes from the surface in a direction perpendicular to the first surface. An edge of the flange includes an insulation displacement contact (IDC) joint for connection to the capacitor leads.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: September 13, 2022
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: Daniel Stremersch, Ligor Manushi, Kenneth Bouman, Hadwan Hadwan, John Janson, Andrew Yermak, Alexander Tsang, Mark Ryskamp, Jesus Antonio Marin Bello, Jeff Reuter
  • Patent number: 11276525
    Abstract: A carrier is configured to house a capacitor that includes a casing, a first capacitor lead that protrudes from the casing and a second capacitor lead that protrudes from the casing. The carrier includes a first container portion and a second container portion. The first container portion and the second container portion have the same shape and dimensions, and when assembled together, define an interior space that receives and retains the capacitor therein.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: March 15, 2022
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: Hadwan Hadwan, John Janson, Andrew Yermak, Alexander Tsang, Mark Ryskamp, Jesus Antonio Marin Bello, Jeff Reuter, Ligor Manushi
  • Patent number: 11259422
    Abstract: A capacitor carrier assembly includes a carrier, a capacitor disposed in the carrier and electrically conductive connection terminals that support the carrier with respect to another electronic component or device such as a printed circuit board. Each connection terminal has a body portion that is electrically connected to one capacitor lead of the pair of capacitor leads at a connection location, and a device connection portion that protrudes from the carrier. Leads of the capacitor and the connection locations are encapsulated by wall structures of the carrier.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: February 22, 2022
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: Daniel Stremersch, Ligor Manushi, Kenneth Bouman, Hadwan Hadwan, John Janson, Andrew Yermak, Alexander Tsang, Mark Ryskamp, Jesus Antonio Marin Bello, Jeff Reuter
  • Publication number: 20210305726
    Abstract: A capacitor carrier assembly includes a carrier, a capacitor disposed in the carrier and electrically conductive connection terminals. The connection terminals support the carrier with respect to another electronic component or device such as a printed circuit board, retain individual carrier portions in an assembled configuration, and provide an electrical connection between the capacitor and the electronic component. Each connection terminal includes an elastic member that protrudes from a surface of the connection terminal and engages the carrier, and regions of serrations provided on opposed edges of the terminal that engage the carrier, and a flange that protrudes from the surface in a direction perpendicular to the first surface. An edge of the flange includes an insulation displacement contact (IDC) joint for connection to the capacitor leads.
    Type: Application
    Filed: March 25, 2020
    Publication date: September 30, 2021
    Inventors: Daniel Stremersch, Ligor Manushi, Kenneth Bouman, Hadwan Hadwan, John Janson, Andrew Yermak, Alexander Tsang, Mark Ryskamp, Jesus Antonio Marin Bello, Jeff Reuter
  • Publication number: 20210304961
    Abstract: A carrier is configured to house a capacitor that includes a casing, a first capacitor lead that protrudes from the casing and a second capacitor lead that protrudes from the casing. The carrier includes a first container portion and a second container portion. The first container portion and the second container portion have the same shape and dimensions, and when assembled together, define an interior space that receives and retains the capacitor therein.
    Type: Application
    Filed: March 25, 2020
    Publication date: September 30, 2021
    Inventors: Hadwan Hadwan, John Janson, Andrew Yermak, Alexander Tsang, Mark Ryskamp, Jesus Antonio Marin Bello, Jeff Reuter, Ligor Manushi
  • Publication number: 20210304962
    Abstract: A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.
    Type: Application
    Filed: March 25, 2020
    Publication date: September 30, 2021
    Inventors: Hadwan Hadwan, John Janson, Andrew Yermak, Alexander Tsang, Mark Ryskamp, Jesus Antonio Marin Bello, Jeff Reuter, Ligor Manushi
  • Publication number: 20210304970
    Abstract: A capacitor carrier assembly includes a carrier, a capacitor disposed in the carrier and electrically conductive connection terminals that support the carrier with respect to another electronic component or device such as a printed circuit board. Each connection terminal has a body portion that is electrically connected to one capacitor lead of the pair of capacitor leads at a connection location, and a device connection portion that protrudes from the carrier. Leads of the capacitor and the connection locations are encapsulated by wall structures of the carrier.
    Type: Application
    Filed: March 25, 2020
    Publication date: September 30, 2021
    Inventors: Daniel Stremersch, Ligor Manushi, Kenneth Bouman, Hadwan Hadwan, John Janson, Andrew Yermak, Alexander Tsang, Mark Ryskamp, Jesus Antonio Marin Bello, Jeff Reuter
  • Patent number: 9875156
    Abstract: A data storage device includes a set of latches, read/write circuitry, a memory, and an interleaver. The set of latches is configured to receive data. The read/write circuitry is coupled to the set of latches. The memory is coupled to the read/write circuitry. The interleaver is configured to interleave the data and to cause the read/write circuitry to program the interleaved data to the memory. The set of latches, the read/write circuitry, the memory, and the interleaver are integrated within a common die.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: January 23, 2018
    Assignee: SanDisk Technologies LLC
    Inventors: Eran Sharon, Ariel Navon, Alexander Tsang-Nam Chu, Wanfang Tsai, Idan Alrod
  • Publication number: 20170097869
    Abstract: A data storage device includes a set of latches, read/write circuitry, a memory, and an interleaver. The set of latches is configured to receive data. The read/write circuitry is coupled to the set of latches. The memory is coupled to the read/write circuitry. The interleaver is configured to interleave the data and to cause the read/write circuitry to program the interleaved data to the memory. The set of latches, the read/write circuitry, the memory, and the interleaver are integrated within a common die.
    Type: Application
    Filed: October 1, 2015
    Publication date: April 6, 2017
    Inventors: ERAN SHARON, ARIEL NAVON, ALEXANDER TSANG-NAM CHU, WANFANG TSAI, IDAN ALROD
  • Patent number: 9293195
    Abstract: A compact and versatile high speed sense amplifier suitable for use in non-volatile memory circuits is presented. The sense amp includes a latch, which is connected to a data bus, and bit line selection circuitry by which it can selectively be connected to one or more bit lines. The sense amp also includes some intermediate circuitry having a first node connectable to a selected bit line through the bit line selection circuitry and a second node that is connectable to the latch circuit. The sense amp can include switches where the second node can be connected to either the value held in the latch or the inverse of the value held in the latch. The sense amp can also include a switch where an internal node of the sense amp can be connected directly to a voltage supply level.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: March 22, 2016
    Assignee: SanDisk Technologies Inc.
    Inventors: Man Lung Mui, Jongmin Park, Hao Thai Nguyen, Juan Carlos Lee, Seungpil Lee, Alexander Tsang-nam Chu
  • Publication number: 20140003153
    Abstract: A compact and versatile high speed sense amplifier suitable for use in non-volatile memory circuits is presented. The sense amp includes a latch, which is connected to a data bus, and bit line selection circuitry by which it can selectively be connected to one or more bit lines. The sense amp also includes some intermediate circuitry having a first node connectable to a selected bit line through the bit line selection circuitry and a second node that is connectable to the latch circuit. The sense amp can include switches where the second node can be connected to either the value held in the latch or the inverse of the value held in the latch. The sense amp can also include a switch where an internal node of the sense amp can be connected directly to a voltage supply level.
    Type: Application
    Filed: November 13, 2012
    Publication date: January 2, 2014
    Applicant: SanDisk Technologies Inc.
    Inventors: Man Lung Mui, Jongmin Park, Hao Thai Nguyen, Juan Carlos Lee, Seungpil Lee, Alexander Tsang-nam Chu