Abstract: Structures and methods for holding heat sinks in contact with electronic devices are described herein. In one embodiment, an assembly for holding a heat sink in contact with an electronic device includes a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.

Abstract: Flow conditioners for use with air inlets on computer cabinets are disclosed herein. In one embodiment, a large computer system includes a plurality of computer cabinets arranged in close proximity to each other. Each of the computer cabinets can include a fan, impellor, or other air mover positioned proximate to an inlet that receives cooling air from a plenum, such as a floor plenum. In this embodiment, a flow conditioner configured in accordance with the present invention can be positioned proximate to the air inlet. The flow conditioner can include a vortex diffuser and a flow-speed normalizer. The flow-speed normalizer can include a perforated screen that forms a cylinder around the inlet, and the vortex diffuser can include one or more vanes that extend across the cylinder adjacent to the inlet.

Abstract: Structures and methods for positioning heat sinks in contact with electronic devices are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device in accordance with one aspect of the invention includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device. The heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure further includes a spring holding portion configured to support a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.

Abstract: Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device, and the heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure can further include a spring holding portion configured to laterally support a coil spring. When the coil spring is laterally supported in the spring holding portion, the coil spring exerts a transverse compression force against the heat sink causing the heat sink to press against the electronic device with a uniform, or an approximately uniform, pressure.

Abstract: Apparatuses and methods for cooling processors and other electronic components in computers and other systems are disclosed herein. A heat sink configured in accordance with one embodiment of the invention includes a heat pipe structure. The heat pipe structure includes an interface portion offset from a body portion by a leg portion. The interface portion is configured to be positioned proximate to a processor or other electronic device, and the body portion is configured to be spaced apart from the electronic device. The heat pipe structure further includes a working fluid. The working fluid is positioned to absorb heat from the electronic device at the interface portion of the heat pipe structure and transfer the heat to the body portion of the heat pipe structure. In one embodiment, the heat sink can further include a plurality of cooling fins attached to the body portion of the heat pipe structure.

Abstract: Systems and methods for cooling computer components in large computer systems are disclosed herein. In one embodiment, a computer system configured in accordance with aspects of the invention can include a computer module positioned in a chassis, and an air mover configured to move air through the chassis and past the computer module. The computer system can further include a pressure sensor operably coupled to the air mover. If the pressure sensor determines that the difference between a first air pressure inside the chassis and a second air pressure outside the chassis is less than a preselected pressure, the air mover can increase the flow of air through the chassis and past the computer module.

Abstract: Systems and methods for cooling computer components housed in cabinets in large computer systems are disclosed herein. In one embodiment, a computer system configured in accordance with the present invention includes a chassis having at least first and second computer module compartments. The first and second computer module compartments are positioned in an air flow path in the chassis. In this embodiment, the computer system further includes a heat exchanger positioned in the air flow path in the chassis at least partially downstream of the first computer module compartment and at least partially upstream of the second computer module compartment. A computer system configured in accordance with another embodiment of the invention includes a heat exchanger positioned at least proximate to a first computer module compartment in an air flow path. The heat exchanger can include at least one internal fluid passage configured to carry a working fluid in phase transition.