Abstract: Provided are novel 1,3-diimine copper complexes, and processes for using 1,3-diimine copper complexes in the deposition of copper on substrates, or in or on porous solids, by atomic layer deposition.

Abstract: Through the invention, an ignition device for explosive forming of work pieces in a forming die, which has an ignition mechanism and an ignition tube, and in which the ignition tube guides the explosion ignited by the ignition mechanism into the work piece inserted in the forming die, is to be improved, in that it permits, in practice, an arrangement of the ignition mechanism and forming die that is easier to handle and geared toward the occurring explosion forces. This task is solved by an ignition device, in which a curved guide is provided between the ignition mechanism and the forming die.

Abstract: With the invention, a method and device for explosive forming of work pieces, in which at least one work piece is arranged in at least one die and deformed by means of an explosive to be ignited, is to be improved, in that an ignition mechanism that is technically simple to handle, is produced with the shortest possible setup time, which permits the most precise possible ignition of the explosive with time-repeatable accuracy. This task is solved by a method and device, in which at least one work piece is arranged in at least one die and deformed by means of an explosive to be ignited, in which the explosive is ignited by means of induction.

Abstract: A concentrator solar cell module comprises at least one solar cell and at least one light concentrating article. The at least one light concentrating article is capable of concentrating about 1.02 to about 2000 sun equivalents of solar energy onto the solar cell(s) and comprises an ionomer composition. The ionomer composition comprises or is produced from an ionomer that has a temperature of onset of creep that is significantly greater than its peak melting temperature.

Abstract: Through the invention, a closure device for explosive forming with a connection unit movable relative to the explosive forming die between a working position on the die and a rest position is to be configured, so that the explosive forming die can be closed in simple and reliable fashion and, at the same time, the explosion forces supported. This task is solved by a closure device, in which a wedge structure is guided to move on a static holding structure and is motion-coupled to the connection unit, the resulting movement of the connection unit being directed across the movement of the wedge structure.

Abstract: It shall be achieved by the invention that a workpiece for an explosion forming process, which can be inserted into a forming tool and which can be deformed from an initial shape by means of explosion forming, and the explosion forming method are improved such that a satisfactory quality of the workpiece with the desired wall thickness is achieved in a simple manner. This object is achieved by a workpiece and a respective explosion forming method in which the initial shape of the workpiece has at least in some portions a supply of material for the explosion forming process, which is pre-formed compared to adjoining portions or which is provided therewith.

Abstract: The present invention relates to novel 1,3-diimines and 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an atomic layer deposition process.

Abstract: An explosion forming apparatus (10) that preferably utilizes a shock wave (42) directed along a work piece (12) to progressively conform the work piece to a contour die cavity (44).

Abstract: Methods of depositing a copper film onto the surface of a substrate from a supercritical solution containing copper-containing precursors having monoanionic bidentate and neutral monodentate ligands, which comprise contacting the substrate with the solution; heating the substrate to a temperature between about 60° C. and less than 150° C.; and forming a copper-containing film on at least a portion of the substrate surface. Also provided are copper-containing precursor compositions used therein.

Abstract: With the invention, a method and a device for explosive forming of a tubular work piece, which comprises a multipart forming die almost fully enclosing the work piece in the closed state, and in which a plug is provided in the area of at least one end of the forming die, is to be improved, in that forming of a tubular work piece is possible in a simple method that promotes fewer individual work steps and is therefore cost-effective. This task is solved by a method and a device for explosive forming, in which a seal between the forming die and the plug is formed when the plug is inserted, in which the work piece end is mounted between the forming die and deformed.

Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.

Abstract: The present invention relates to a process for the synthesis of novel 1,3-diimine copper complexes using amino-imines and novel amino-imines.

Abstract: Constant current power supply arrangements can charge a capacitor with a constant current and are suitable as power supplies for laser diodes. A power supply for a laser diode comprises: a variable voltage power supply, a load path for carrying a laser diode, a shunt path connected in parallel with the load path, a current draining element for switching the shunt path, the current draining element being associated via a first feedback element with the variable voltage power supply such that current drained by the current draining element provides first feedback control of a voltage level of the variable voltage power supply, and a voltage operated second feedback element associated with both the load path and the shunt path to provide second feedback control of the current draining element to drain current via the current draining element in response to current changes at the load.

Abstract: There are provided compounds of Ir(III) having ?-diketimine ligands. The complexes having Formulae I: where: L is the same or different at each occurrence and is a cyclometalating bidentate monoanionic ligand coordinated through a nitrogen atom and a carbon atom; R1 and R3 can be the same or different and are independently selected from the group consisting of hydrogen, halogen, alkyl, aryl, alkylaryl and heterocyclic groups; and R10 and R11 can be the same or different and are independently selected from the group consisting of hydrogen, halogen, alkyl, aryl, alkylaryl, trialkylsilyl, triarylsilyl, and heterocyclic groups; and R2 is selected from the group consisting of hydrogen, alkyl, aryl, alkylaryl, heterocyclic groups, and fluorine wherein adjacent R groups can join together to form 5- or 6-membered rings. R8 is H, F, or alkyl There are also provided electronic devices containing such compounds.

Abstract: The present invention relates to novel 1,3-diimines and 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an atomic layer deposition process.

Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.

Abstract: The composition relates to amino-imine compounds used in the formation of 1,3-diimine copper complexes for deposition of copper films.

Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.

Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. This invention also provides a process for making amino-imines and novel amino-imines.

Abstract: The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.