Abstract: A method of forming a semiconductor device, where the method includes receiving a substrate in a processing chamber, the substrate including a first patterned layer including a metal-based material; and with a gaseous etch process, trimming the first patterned layer to form a second patterned layer, the gaseous etch process including exposing the first patterned layer to an un-ionized gas including a halogen compound.

Abstract: This invention relates to a modified phenolic resin and a process of modifying a phenolic resin by an ethylenically unsaturated carboxylate compound. The ethylenically unsaturated carboxylate compound contains a thermally polymerizable or crosslinkable functional group, and has affinity to or is chemically bonded to the hydroxyl phenyl or the benzene ring of the phenolic resin, thereby introducing the thermally polymerizable or crosslinkable functional group in the phenolic resin. The invention also relates to a rubber composition comprising a rubber component and the modified phenolic resin component wherein the rubber composition does not contain a methylene donor cross-linking agent that decomposes to an aldehyde. The invention also relates to a formaldehyde-free process for preparing a rubber composition comprising mixing a rubber component and the modified phenolic resin component, wherein the process does not emit formaldehyde.

Abstract: This invention relates to resins having a molar ratio of methylol groups to ether groups in the resin is from 0.5:1 to about 2:1. Methods for making the composition are also provided. A bladder formulation comprising resins of the invention is also provided. A vulcanized elastomer composition prepared by vulcanizing the bladder formulation of the invention is also provided. A method of increasing thermal stability in a rubber by curing said rubber with a resin of the invention is also provided.

Abstract: This invention relates to a phenolic resin composition comprising a phenolic resin admixed with and/or modified by one or more functionalized organosulfur compounds. This invention also relates to a rubber composition comprising (i) a natural rubber, a synthetic rubber, or a mixture thereof; (ii) one or more phenolic resins; and (iii) one or more functionalized organosulfur compounds. The interaction between the component (i) and the components (ii) and (iii) reduces the hysteresis increase compared to a rubber composition without the component (iii), upon curing the rubber composition. The invention also relates to a process for preparing the phenolic resin composition, a process for preparing the rubber composition, and a process for reducing the hysteresis increase caused in a rubber composition when a phenolic resin is added to a rubber composition.

Abstract: This invention relates to a process of mixing a phenolic resin and one or more functionalized organosulfur compounds into a rubber composition comprising a rubber component. The interaction between the phenolic resin component and the functionalized organosulfur compound component with the rubber component reduces the hysteresis increase compared to a rubber composition without the functionalized organosulfur compound component, upon curing the rubber composition. The invention also relates to a rubber composition prepared according to this process and a rubber product formed from the rubber composition.

Abstract: This invention relates to a phenolic resin composition comprising a phenolic resin admixed with and/or modified by one or more functionalized organosulfur compounds. This invention also relates to a rubber composition comprising (i) a natural rubber, a synthetic rubber, or a mixture thereof; (ii) one or more phenolic resins; and (iii) one or more functionalized organosulfur compounds. The interaction between the component (i) and the components (ii) and (iii) reduces the hysteresis increase compared to a rubber composition without the component (iii), upon curing the rubber composition. The invention also relates to a process for preparing the phenolic resin composition, a process for preparing the rubber composition, and a process for reducing the hysteresis increase caused in a rubber composition when a phenolic resin is added to a rubber composition.