Abstract: A method of manufacturing a magnetic field sensor device in one embodiment includes applying a mask on a substrate, performing a wet etching procedure on the substrate for generating at least a first groove having tilted side walls, and depositing at least one layer of magnetoresistive material onto a section of the surface of at least a first tilted side wall of the groove. A method of manufacturing a magnetic field sensor device on a substrate having a plurality of tilted planar sections, each of the tilted planar sections having a surface normal angled with respect to a surface normal of the substrate is also provided.

Abstract: A magnetic field sensor device comprising a substrate having at least a first tilted planar section having a surface normal at a first angle with respect to a surface normal of the substrate, and at least a first magnetoresistive layered structure positioned at the at least first tilted section. Methods for manufacturing magnetic field sensor devices are also presented.

Abstract: A method of manufacturing a magnetic field sensor device in one embodiment includes applying a mask on a substrate, performing a wet etching procedure on the substrate for generating at least a first groove having tilted side walls, and depositing at least one layer of magnetoresistive material onto a section of the surface of at least a first tilted side wall of the groove. A method of manufacturing a magnetic field sensor device on a substrate having a plurality of tilted planar sections, each of the tilted planar sections having a surface normal angled with respect to a surface normal of the substrate is also provided.

Abstract: Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.

Abstract: Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.

Abstract: A magnetic field sensor device comprising a substrate having at least a first tilted planar section having a surface normal at a first angle with respect to a surface normal of the substrate, and at least a first magnetoresistive layered structure positioned at the at least first tilted section. Methods for manufacturing magnetic field sensor devices are also presented.

Abstract: Disclosed is a method to build rounded forms on a substrate by means of a masking layer covering at least parts of a substrate by applying the masking layer in a predetermined thickness to the substrate, such that the layer fixedly adheres to the substrate, performing a photo step, developing the masking layer, contracting the masking layer when adhering to the substrate by an irreversible shrinking process with predefined process control parameters, performing the etching process with a shrunk masking layer and etching at least in part through the shrunk masking layer.