Patents by Inventor Alexandra Wright
Alexandra Wright has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240014904Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.Type: ApplicationFiled: September 20, 2023Publication date: January 11, 2024Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
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Publication number: 20230343655Abstract: A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.Type: ApplicationFiled: July 3, 2023Publication date: October 26, 2023Inventors: Roy Edward Meade, Anatol Khilo, Forrest Sedgwick, Alexandra Wright
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Patent number: 11799554Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.Type: GrantFiled: July 16, 2022Date of Patent: October 24, 2023Assignee: Ayar Labs, Inc.Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
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Patent number: 11777633Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: GrantFiled: January 24, 2022Date of Patent: October 3, 2023Assignee: Ayar Labs, Inc.Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
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Patent number: 11694935Abstract: A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.Type: GrantFiled: October 23, 2020Date of Patent: July 4, 2023Assignee: Ayar Labs, Inc.Inventors: Roy Edward Meade, Anatol Khilo, Forrest Sedgwick, Alexandra Wright
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Patent number: 11563506Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: GrantFiled: August 24, 2021Date of Patent: January 24, 2023Assignee: Ayar Labs, Inc.Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
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Publication number: 20220407606Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.Type: ApplicationFiled: August 22, 2022Publication date: December 22, 2022Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden
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Publication number: 20220360336Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.Type: ApplicationFiled: July 16, 2022Publication date: November 10, 2022Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
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Patent number: 11424830Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.Type: GrantFiled: September 8, 2020Date of Patent: August 23, 2022Assignee: Ayar Labs, Inc.Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden
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Patent number: 11405125Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: GrantFiled: July 12, 2019Date of Patent: August 2, 2022Assignee: Ayar Labs, Inc.Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
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Patent number: 11394465Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.Type: GrantFiled: August 18, 2020Date of Patent: July 19, 2022Assignee: Ayar Labs, Inc.Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
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Publication number: 20220224433Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: ApplicationFiled: January 24, 2022Publication date: July 14, 2022Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
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Publication number: 20220171142Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.Type: ApplicationFiled: February 14, 2022Publication date: June 2, 2022Inventors: Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Roy Edward Meade, Derek Van Orden
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Patent number: 11249260Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.Type: GrantFiled: July 23, 2020Date of Patent: February 15, 2022Assignee: Ayar Labs, Inc.Inventors: Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Roy Edward Meade, Derek Van Orden
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Publication number: 20220045780Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: ApplicationFiled: August 24, 2021Publication date: February 10, 2022Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
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Patent number: 11233596Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: GrantFiled: July 12, 2019Date of Patent: January 25, 2022Assignee: Ayar Labs, Inc.Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
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Patent number: 11101912Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: GrantFiled: July 12, 2019Date of Patent: August 24, 2021Assignee: Ayar Labs, Inc.Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
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Publication number: 20210124107Abstract: A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.Type: ApplicationFiled: October 23, 2020Publication date: April 29, 2021Inventors: Roy Edward Meade, Anatol Khilo, Forrest Sedgwick, Alexandra Wright
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Publication number: 20200403703Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.Type: ApplicationFiled: September 8, 2020Publication date: December 24, 2020Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden
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Publication number: 20200382215Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.Type: ApplicationFiled: August 18, 2020Publication date: December 3, 2020Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport