Patents by Inventor Alexandre Christian Volatier

Alexandre Christian Volatier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10217677
    Abstract: Methods of fabricating semiconductor devices and Radio Frequency (RF) components are provided. The method includes providing a circuit layout on a semiconductor layer and providing one or more sacrificial connections to connect bump pads in the circuit layout. The method also includes testing the circuit layout using the one or more sacrificial connections and removing at least a portion of the one or more sacrificial connections. In this way, the performance of the semiconductor device is improved by reducing or avoiding capacitive or inductive leakage paths that can be caused by leftover materials.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: February 26, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Alexandre Christian Volatier, Guillermo Moreno Granado
  • Publication number: 20180240719
    Abstract: Methods of fabricating semiconductor devices and Radio Frequency (RF) components are provided. The method includes providing a circuit layout on a semiconductor layer and providing one or more sacrificial connections to connect bump pads in the circuit layout. The method also includes testing the circuit layout using the one or more sacrificial connections and removing at least a portion of the one or more sacrificial connections. In this way, the performance of the semiconductor device is improved by reducing or avoiding capacitive or inductive leakage paths that can be caused by leftover materials.
    Type: Application
    Filed: April 16, 2018
    Publication date: August 23, 2018
    Inventors: Alexandre Christian Volatier, Guillermo Moreno Granado
  • Patent number: 10037925
    Abstract: Methods of fabricating semiconductor devices and Radio Frequency (RF) components are provided. The method includes providing a circuit layout on a semiconductor layer and providing one or more sacrificial connections to connect bump pads in the circuit layout. The method also includes testing the circuit layout using the one or more sacrificial connections and removing at least a portion of the one or more sacrificial connections. In this way, the performance of the semiconductor device is improved by reducing or avoiding capacitive or inductive leakage paths that can be caused by leftover materials.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: July 31, 2018
    Assignee: Qorvo US, Inc.
    Inventors: Alexandre Christian Volatier, Guillermo Moreno Granado
  • Publication number: 20170256467
    Abstract: Methods of fabricating semiconductor devices and Radio Frequency (RF) components are provided. The method includes providing a circuit layout on a semiconductor layer and providing one or more sacrificial connections to connect bump pads in the circuit layout. The method also includes testing the circuit layout using the one or more sacrificial connections and removing at least a portion of the one or more sacrificial connections. In this way, the performance of the semiconductor device is improved by reducing or avoiding capacitive or inductive leakage paths that can be caused by leftover materials.
    Type: Application
    Filed: November 21, 2016
    Publication date: September 7, 2017
    Inventors: Alexandre Christian Volatier, Guillermo Moreno Granado