Abstract: This disclosure provides modelling techniques for accurately and reliably analyzing printed parts. More specifically, a model with a powder representation may be used for the thermal analysis, the powder representation may then be removed from the model for performing the structural analysis. Although the powder representation is removed from the model for the structural analysis, the structural analysis still factors in the thermal effects of the powder on the part determined by the thermal analysis. The computer-based techniques of the current disclosure improve the functioning of a computer system as compared to conventional approaches by facilitating analyses (e.g., thermal, mechanical, design, and heat treatment analyses) that are more accurate, more efficient (e.g., faster, smaller memory requirements, etcetera), and/or have a reduced processing burden versus conventional approaches.

Abstract: This disclosure provides modelling techniques for accurately and reliably analyzing printed parts. More specifically, a model with a powder representation may be used for the thermal analysis, the powder representation may then be removed from the model for performing the structural analysis. Although the powder representation is removed from the model for the structural analysis, the structural analysis still factors in the thermal effects of the powder on the part determined by the thermal analysis. The computer-based techniques of the current disclosure improve the functioning of a computer system as compared to conventional approaches by facilitating analyses (e.g., thermal, mechanical, design, and heat treatment analyses) that are more accurate, more efficient (e.g., faster, smaller memory requirements, etcetera), and/or have a reduced processing burden versus conventional approaches.