Patents by Inventor Alexandre STAUB

Alexandre STAUB has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12097662
    Abstract: The invention concerns a method for additive manufacturing a component by repetitively superposing and solidifying material layers according to a 3D model of the component. The method comprises the steps of scan, by means of an eddy current sensing unit (20), of a new solidified cross section (15) obtained by selectively solidifying a material layer so as to provide an integrity data (VMM) of a sensed portion (23). A difference between the sensed integrity data (VMM) and an expected integrity data (VEE) is then executed for detecting a manufacturing anomaly within this portion. The expected integrity data (VEE) is determined based on collected integrity data of a solid basic structure likely matching or being identical to a geometrical structure (41) obtained from the 3D model (40) of a portion corresponding to said sensed portion (23), said solid basic structure being manufactured or simulated according to another 3D model.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: September 24, 2024
    Assignee: SENSIMA INSPECTION SÅRL
    Inventors: Marc Lany, Frédéric Monnier, Bernard Revaz, Gilles Santi, Adrian Spierings, Philipp Stoll, Alexandre Staub
  • Publication number: 20210154745
    Abstract: The invention concerns a method for additive manufacturing a component by repetitively superposing and solidifying material layers according to a 3D model of the component. The method comprises the steps of scan, by means of an eddy current sensing unit (20), of a new solidified cross section (15) obtained by selectively solidifying a material layer so as to provide an integrity data (VMM) of a sensed portion (23). A difference between the sensed integrity data (VMM) and an expected integrity data (VEE) is then executed for detecting a manufacturing anomaly within this portion. The expected integrity data (VEE) is determined based on collected integrity data of a solid basic structure likely matching or being identical to a geometrical structure (41) obtained from the 3D model (40) of a portion corresponding to said sensed portion (23), said solid basic structure being manufactured or simulated according to another 3D model.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 27, 2021
    Inventors: Marc LANY, Frédéric MONNIER, Bernard REVAZ, Gilles SANTI, Adrian SPIERINGS, Philipp STOLL, Alexandre STAUB