Abstract: A light source of a matrix arrangement of light sources of a motor vehicle lighting module includes a substrate having an upper face, a lower face opposite the upper face, and an electronic circuit. At least one light-emitting element is mounted on the upper face of the substrate and includes a light-emitting part. Also included is an optical device for forming the light beams emitted by the light-emitting element, and the lower face includes connection contacts connected to the electronic circuit, the electronic circuit being adapted to power the at least one light-emitting element. The light-emitting part of at least one light-emitting element having a surface area of less than 40,000 ?m2. The optical device includes an optical element that is produced by being molded onto the at least one light-emitting element and at least partially onto the upper face of the substrate.

Abstract: A light source a matrix arrangement of light sources of a motor vehicle lighting module includes a substrate having an upper face, a lower face opposite the upper face, and an electronic circuit. At least one light-emitting element is mounted on the upper face of the substrate and includes a light-emitting part. Also included is an optical device for forming the light beams emitted by the light-emitting element and the lower face includes connection contacts connected to the electronic circuit, the electronic circuit being adapted to power the at least one light-emitting element. The light-emitting part of at least one light-emitting element has a surface area of less than 40,000 ?m2, and the beam-forming optical device has an optical element on the upper face of the substrate and/or on the light-emitting part of the at least one light emitting element.

Abstract: A lighting module for a motor vehicle signaling device includes a substrate provided with an electronic circuit on which a matrix arrangement of elementary light sources is mounted, and wall through which light emitted from the light sources can pass. The substrate and/or all or part of the elementary light sources are bonded to the wall.

Abstract: A motor vehicle signaling device light module includes a substrate on which a matrix arrangement of elementary light sources is mounted, a connector fixed to the substrate having a rectangular footprint with a long side and a narrow side, and a support designed to hold the substrate in position in the signaling device. The substrate is curved around an axis of curvature, and the light sources are arranged to produce a convex display from the point of view of a user outside of the vehicle, so that the long side of the connector is substantially parallel to the axis of curvature.

Abstract: A lighting module of a motor vehicle signaling device includes a ceramic substrate having opposite first and second faces, and a plurality of selectively activatable light sources mounted on the first face of the ceramic substrate. Each of the first and second faces of the ceramic substrate are provided with at least a first and a second respective interconnection layer. The ceramic substrate comprises a plurality of through holes designed to interconnect the first interconnection layer to the second interconnection layer.

Abstract: The invention relates to an assembly of light sources including an integrated circuit with a connection pad, a light-emitting part with micro-LEDs and an active surface, a fan-out encapsulation surrounding at least a part of the integrated circuit, a first multilayer metal layer, a second metal layer that includes contact parts being in direct contact with a rear face of the integrated circuit, a heat sink, a matrix fixation layer arranged between the second metal layer and the heat sink and a printed circuit board. The first metal layer is arranged so as to cover at least a part of the front face of the integrated circuit, providing an electrical connection between the pad of the integrated circuit and a pad of the assembly.

Abstract: The invention relates to a matrix light source having a plurality of elementary light sources with a light-emitting semiconductor element and an integrated circuit which includes the control logic pertaining to the elementary light sources of the matrix. The architecture of the light source is adjustable in that during production the size of the integrated circuit can be adapted to house matrices of different sizes using a repeatable structure.

Abstract: An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit.

Abstract: An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit.

Abstract: A process for manufacturing at least one 3D electronic module each comprises a stack of electronic packages and/or printed wiring boards, wherein a stack is placed on an electrically interconnecting system comprising metal leads each having two ends.

Abstract: A process for manufacturing at least one 3D electronic module each comprises a stack of electronic packages and/or printed wiring boards, wherein a stack is placed on an electrically interconnecting system comprising metal leads each having two ends.

Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.

Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.