Abstract: A dynamic polarization controller (“DPC”) that and method of dynamic polarization control useful in optical networks is disclosed. The DPC of the present invention has a polymeric optical waveguide formed on a substrate, such as a silicon wafer. An intermediate portion of the waveguide is suspended over a cavity, and a deflecting structure, such as an electrodes, is provided for controllably exerting a force on the suspended portion of the waveguide. Exerting a deflecting force on the suspended portion of the waveguide induces controllable birefringence in the waveguide core and, thereby allows dynamic control over the polarization properties of light passing through the DPC. An array of DPC's of the present invention can be formed on a single substrate and used in an optical network, for example a WDM system whereby plural light signals traveling through a single optical fiber are demultiplexed for processing.

Abstract: Disclosed are optical modulators that provide high-speed modulation capability and compact size. In exemplary modulator embodiments, the branch waveguide cores are formed in different processing layers than the input waveguide core, and light is coupled from an input waveguide core to two branch waveguide cores along diagonal directions. The construction enables the input waveguide core to be made of low-loss material compared to the electro-optic material of the branch waveguide cores. Also disclosed are interconnect apparatuses that can be used in processing systems. Exemplary interconnect apparatuses provide various configurations of components that enable high-speed modulation and compact size. The exemplary interconnect apparatuses may use the exemplary optical modulators disclosed herein.

Abstract: A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.

Abstract: Disclosed are optical modulators that provide high-speed modulation capability and compact size. In exemplary modulator embodiments, the branch waveguide cores are formed in different processing layers than the input waveguide core, and light is coupled from an input waveguide core to two branch waveguide cores along diagonal directions. The construction enables the input waveguide core to be made of low-loss material compared to the electro-optic material of the branch waveguide cores. Also disclosed are interconnect apparatuses that can be used in processing systems. Exemplary interconnect apparatuses provide various configurations of components that enable high-speed modulation and compact size. The exemplary interconnect apparatuses may use the exemplary optical modulators disclosed herein.

Abstract: Methods and apparatuses for measuring the optical properties of solids, gels, and liquids are disclosed. The apparatuses may be constructed on miniature substrates using conventional semiconductor wafer and packaging processes. The substrates may be mass-produced on wafers, which are then diced to provide individual miniature substrates. High measurement precision, low-manufacturing costs, and other benefits are provided by the present inventions.

Abstract: The present invention provides an optical interconnection platform, comprising a substrate, a plurality of integrated circuits attached to a surface of the substrate wherein each integrated circuit having an array of transmitters and an array of receivers, an optical integrated circuit module attached to an opposing surface of the substrate wherein the optical integrated circuit module comprising a highly transparent photosensitive material having an input microlens that collimate the light beams before entering the optical integrated circuit module and an output microlens that focuses the light beams into the array of receivers, and input and output Bragg diffractive gratings that are formed inside of the optical integrated circuit module.

Abstract: Optical apparatuses providing optical interconnections among a plurality N of electronic components. One exemplary apparatus comprises a slab waveguide having a core layer that enables light beams to propagate in a plurality of directions, a plurality of N reception ports, and a plurality of N transmission ports, each reception port and each transmission port serving a respective electronic component, and each being optically coupled to the core layer of the slab waveguide. Each transmission port is configured to receive a plurality of light beams from its assigned electronic component and to transmit each received light beam onto the slab waveguide in a direction toward a reception port. Each reception port is configured to receive from the slab waveguide a plurality of light beams transmitted to it from at least two different transmission ports. Light beams within the slab waveguide are permitted to cross paths. Other exemplary embodiments are disclosed.

Abstract: The present invention provides an optical bridge for interconnecting optical networking components and methods of making optical bridges that include a waveguide that are compatible with semiconductor processing steps. The optical bridge of the present invention has less optical losses and is less affected by misalignment that prior art interconnections. The waveguide is formed of a curable optical material that spans optically active areas of two components. In one embodiment of the present invention, one optical component is an optical circuit board and the connected optical component is an electro-optical integrated circuit package containing light emitting or light receiving elements. The method provides a curable optical liquid to the components, bringing the components together to form a continuous optical liquid between the components, and curing the optical liquid.

Abstract: A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.

Abstract: A dynamic polarization controller (“DPC”) that and method of dynamic polarization control useful in optical networks is disclosed. The DPC of the present invention has a polymeric optical waveguide formed on a substrate, such as a silicon wafer. An intermediate portion of the waveguide is suspended over a cavity, and a deflecting structure, such as an electrodes, is provided for controllably exerting a force on the suspended portion of the waveguide. Exerting a deflecting force on the suspended portion of the waveguide induces controllable birefringence in the waveguide core and, thereby allows dynamic control over the polarization properties of light passing through the DPC. An array of DPC's of the present invention can be formed on a single substrate and used in an optical network, for example a WDM system whereby plural light signals traveling through a single optical fiber are demultiplexed for processing.

Abstract: A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.

Abstract: The intensity of signals in optical networks can be controlled using a variable optical attenuator (VOA). The present invention is a VOA that is particularly well suited for optical networks, for example to provide channel-by-channel normalization of gain control of wavelength division multiplexed signals. The inventive VOA includes a waveguide having a cladding that includes an electro-optical material and electrodes that produce an electric field within the electro-optical material when a voltage difference is applied to the electrodes. The VOA also includes a layer that is parallel to the core of the waveguide and that optically couples to the core to receive light from the attenuated signal. A power meter receives light from the layer as an indication of the amount of light attenuated from the signal and for controlling the voltage to the electrodes.

Abstract: An electro-optical deflector device, having a thin ferroelectric oxide film and a method of fabricating the deflector device is described. One embodiment of a thin film electro-optic deflector device includes: a planar optical waveguide, having a thin ferroelectric oxide layer; a first electrode, having a conductive substrate and a conductive epoxy; a second electrode coupled to the planar optical waveguide; a supporting substrate; a cladding layer attached to the second electrode deposited on the supporting substrate; and a hole through the supporting substrate and the cladding layer for connecting the second electrode to an external voltage source.

Abstract: A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.

Abstract: A tunable micro-lens and micro-lens array for use in optical communications are disclosed. The micro-lens uses thermo optical material and a temperature controller to adjust the temperature and, hence, the index of refraction of the thermo optical material. In one embodiment, a single temperature controller is used to maintain an array of micro-lenses at a desired temperature. In an alternate embodiment, the individual lenses in an array are separately tunable. The invention may be used with either 2D or 3D lenses, and is well suited for use with existing planar lightwave circuit (PLC) technology.

Abstract: A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.

Abstract: Optical apparatuses providing optical interconnections among a plurality N of electronic components. One exemplary apparatus comprises a slab waveguide having a core layer that enables light beams to propagate in a plurality of directions, a plurality of N reception ports, and a plurality of N transmission ports, each reception port and each transmission port serving a respective electronic component, and each being optically coupled to the core layer of the slab waveguide. Each transmission port is configured to receive a plurality of light beams from its assigned electronic component and to transmit each received light beam onto the slab waveguide in a direction toward a reception port. Each reception port is configured to receive from the slab waveguide a plurality of light beams transmitted to it from at least two different transmission ports. Light beams within the slab waveguide are permitted to cross paths. Other exemplary embodiments are disclosed.

Abstract: Methods and apparatuses for measuring the optical properties of solids, gels, and liquids are disclosed. The apparatuses may be constructed on miniature substrates using conventional semiconductor wafer and packaging processes. The substrates may be mass-produced on wafers, which are then diced to provide individual miniature substrates. High measurement precision, low-manufacturing costs, and other benefits are provided by the present inventions.

Abstract: A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.

Abstract: The present invention provides an optical bridge for interconnecting optical networking components and methods of making optical bridges that include a waveguide that are compatible with semiconductor processing steps. The optical bridge of the present invention has less optical losses and is less affected by misalignment that prior art interconnections. The waveguide is formed of a curable optical material that spans optically active areas of two components. In one embodiment of the present invention, one optical component is an optical circuit board and the connected optical component is an electro-optical integrated circuit package containing light emitting or light receiving elements. The method provides a curable optical liquid to the components, bringing the components together to form a continuous optical liquid between the components, and curing the optical liquid.