Patents by Inventor Alexei Leonov

Alexei Leonov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper barrier chemical-mechanical polishing composition
    Patent number: 9556363
    Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of at least one of a copper, a copper barrier, and a dielectric layer.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: January 31, 2017
    Assignee: Cabot Microelectronics Corporation
    Inventors: Lin Fu, Steven Grumbine, Jeffrey Dysard, Wei Weng, Lei Liu, Alexei Leonov
  • Pathogen detection
    Patent number: 9250238
    Abstract: Pathogens are detected through the use of mutation-resistant ligands.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: February 2, 2016
    Assignee: Purdue Research Foundation
    Inventors: Philip S. Low, Alexander Wei, Ronald G. Reifenberger, Youngsoon Kim, Avijit Kumar Adak, David Lyvers, Kulbhushan Durugkar, Derek Doorneweerd, Rajendra P. Bandari, Rajesh Kumar Pandey, Alexei Leonov, Walter A. Henne, Yeong E. Kim
  • COPPER BARRIER CHEMICAL-MECHANICAL POLISHING COMPOSITION
    Publication number: 20150376463
    Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of at least one of a copper, a copper barrier, and a dielectric layer.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Lin Fu, Steven Grumbine, Jeffrey Dysard, Wei Weng, Lei Liu, Alexei Leonov