Abstract: Aspects of the present disclosure relate generally to night-vision systems and more specifically to an integrated micro-display module with a flex circuit. One example illustrated herein includes a method of upgrading a night-vision system. The method may include attaching a flex circuit to an intensifier module, in which the flex circuit includes one or more light detectors and extending beyond a leading edge of the intensifier module. The method may include inserting the intensifier module into a housing and folding the flex circuit to expose the one or more light detectors. The method may further include optically coupling a display unit to an output side of an intensifier module of the night vision system. The display unit may be configured to display graphical content in a field of view together with night-vision images from an output of the intensifier module of the night-vision system.

Abstract: A modified nightvision system. The nightvision system includes an intensifier module configured to intensify received light input into the intensifier module. The intensifier module has an input side configured to receive photons of the received light and an output side configured to output intensified light resulting from the received light. The night vision system includes an added display unit proximate the output side of the intensifier module, the display unit configured to output graphical content. The night vision system includes an added beam combiner optically coupled to the display unit and the output side of the intensifier module. The beam combiner is configured to combine the intensified light and graphical content. The night vision system includes an eyepiece optically coupled to the beam combiner. The eyepiece is configured to receive the combined intensified light and graphical content and to provide the combined intensified light and graphical content to a user.

Abstract: An isolation valve is preferably applied to the semiconductor industry for sealing a process vessel and also operates effectively at plus-atmospheric pressures. A double containment gate valve assembly includes a housing and a movable head assembly within the housing. The housing includes a first access opening and a second access opening. The head assembly is configurable into a first position where an access path through the first and second access openings is clear, and a second position where the access path is blocked.

Abstract: An isolated semiconductor wafer platen is disclosed for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is well known in the art and can be applied to high pressure systems as well, but some difficulties can arise under high pressure processes. Small deflections in even very thick metal support platens can lead to backside wafer wear, platen abrasion, and even breakage of semiconductor wafers. This invention discloses a method to eliminate the transfer of flexure inherent in high pressure vessel walls, yet still retain the vacuum chucking method.

Abstract: A valve for redirecting flow in a supercritical fluid or other high pressure processing system is disclosed. In high pressure supercritical carbon dioxide (SCCO2) equipment for semiconductor wafer processing, a major hurtle in providing clean equipment and clean wafers. A clean flow diverting valve is provided having no grease or other contaminants, and having no rubbing seal surfaces, but rather incorporates a magnetically coupled valve actuator to move a ball or other valve seat for diverting flow between a common port and alternative switched ports in a non-rubbing, non-contact manner. The valve is useful in semiconductor wafer high pressure processing tools for redirecting flow from a common inlet to alternative outlets or for admitting flow from alternative inlets to a common outlet.

Abstract: An isolation valve is preferably applied to the semiconductor industry for sealing a process vessel and also operates effectively at plus-atmospheric pressures. A double containment gate valve assembly includes a housing and a movable head assembly within the housing. The housing includes a first access opening and a second access opening. The head assembly is configurable into a first position where an access path through the first and second access openings is clear, and a second position where the access path is blocked.

Abstract: Pressure biased wafer holding of a semiconductor wafer is provided for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is applied to high pressure systems. Adverse effects of high pressure biases are prevented by a valve arrangement that reduces or limits the holding load on a wafer. Check valves and on-off valves connected to input and output lines to the chamber bias fluid applied to a wafer supporting platen to vary the backside pressure so that the excess of frontside pressure versus backside pressure on the wafer is kept within an effective clamping range without excessive force being applied to the wafer. Use of fluid-mechanical techniques is maximized in certain described embodiments to avoid disadvantages of electronic control systems.

Abstract: A valve for redirecting flow in a supercritical fluid or other high pressure processing system is disclosed. In high pressure supercritical carbon dioxide (SCCO2) equipment for semiconductor wafer processing, a major hurtle in providing clean equipment and clean wafers. A clean flow diverting valve is provided having no grease or other contaminants, and having no rubbing seal surfaces, but rather incorporates a magnetically coupled valve actuator to move a ball or other valve seat for diverting flow between a common port and alternative switched ports in a non-rubbing, non-contact maimer. The valve is useful in semiconductor wafer high pressure processing tools for redirecting flow from a common inlet to alternative outlets or for admitting flow from alternative inlets to a common outlet.

Abstract: An isolated semiconductor wafer platen is disclosed for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is well known in the art and can be applied to high pressure systems as well, but some difficulties can arise under high pressure processes. Small deflections in even very thick metal support platens can lead to backside wafer wear, platen abrasion, and even breakage of semiconductor wafers. This invention discloses a method to eliminate the transfer of flexure inherent in high pressure vessel walls, yet still retain the vacuum chucking method.

Abstract: A vacuum chuck for holding a semiconductor wafer during high pressure, preferably supercritical, processing comprising: a wafer holding region for holding the wafer; a vacuum region for applying vacuum to a surface of the wafer, the vacuum region within the wafer holding region; and a material, preferably sintered material, applied within the vacuum region, the material configurable to provide a uniform surface between the surface of the wafer and the wafer holding region, wherein the material is configured to allow vacuum to flow therethrough. The vacuum region preferably comprises at least one vacuum groove. Alternatively, the vacuum region includes at least two vacuum grooves that are concentrically configured on the wafer holding region. The vacuum groove alternatively comprises a tapered configuration. Alternatively, a coating material is applied between the wafer surface and the substantially smooth holding region surface, whereby the coating provides a seal between the wafer and the holding region.

Abstract: A processing system utilizing a supercritical fluid for treating a substrate is described as having internal members having a coating. For example, the coating in internal members can reduce particulate contamination during processing. Additionally, a method for using the processing system is described.

Abstract: A closure assembly coupled to a vessel including a chamber and an access port in communication with the chamber, the closure assembly comprising: a door assembly coupled to the vessel and configured to move between an open position and a closed position, the door assembly in contact with the access port at a first location thereby sealing the chamber in the closed position, wherein pressure within the chamber applies a force to the door assembly at the first location. An actuator in moveable contact with the door assembly at a second location, the actuator configured to apply a counteracting force to the door assembly at the second location in response to pressure within the chamber to maintain the door assembly in the closed position. The actuator moves between a non-actuated and actuated position within an actuator bore, the actuator in the actuated position when a desired amount of pressure is applied to the actuator bore.

Abstract: A vacuum chuck for holding a semiconductor wafer during high pressure, preferably supercritical, processing comprising: a wafer holding region for holding the wafer; a vacuum region for applying vacuum to a surface of the wafer, the vacuum region within the wafer holding region; and a material, preferably sintered material, applied within the vacuum region, the material configurable to provide a uniform surface between the surface of the wafer and the wafer holding region, wherein the material is configured to allow vacuum to flow therethrough. The vacuum region preferably comprises at least one vacuum groove. Alternatively, the vacuum region includes at least two vacuum grooves that are concentrically configured on the wafer holding region. The vacuum groove alternatively comprises a tapered configuration. Alternatively, a coating material is applied between the wafer surface and the substantially smooth holding region surface, whereby the coating provides a seal between the wafer and the holding region.

Abstract: A vacuum chuck for holding a semiconductor wafer during supercritical processing comprising: a substantially smooth wafer holding region for holding the semiconductor wafer; a vacuum port for applying vacuum to a portion of the wafer holding region; and a material applied between the semiconductor wafer and the wafer holding region, the material being conformable to provide substantially intimate contact between the surface of the semiconductor wafer and the wafer holding region. The material is preferably a polymer, monomer or any other suitable material is contemplated. The vacuum chuck further comprising a vacuum region configured within the wafer holding region, wherein the vacuum region is coupled to the vacuum port.

Abstract: A pressure enhanced valve comprising: a diaphragm for controlling a flow of fluid media having a first pressure entering through a first chamber, the diaphragm having a first side within the first chamber wherein the first pressure is applied to the first side; and a pressure inlet for providing a second pressure to a second side of the diaphragm in a second chamber, the second side configured opposite of the first side, wherein the first chamber and the second chamber are separately sealed from one another. The first and second pressures are any appropriate amount in relation to one another. The pressure inlet supplies internal working fluid tapped from an internal port or externally supplied fluid at the second pressure. The valve further comprising a control circuit coupled to the pressure source. The valve alternatively includes a filter element and a pressure regulator positioned within the pressure inlet.

Abstract: A support member for use in groups of three or more to support and sonically damp a speaker enclosure. Each support member includes an intermediate piece which is preferably generally conical, a resilient damper element disk overlaying the piece upper, larger end and a pin extending downwardly from the piece lower, smaller end. The dimensions of the three principal components are selected such that a speaker enclosure is supported just above a carpet with the pin extending down through the carpet, through any backing or pad beneath the carpet and to an underlying rigid floor, typically concrete. This serves to directly couple the speaker enclosure to the massive substructure. The diameter of the pin is preferably no more than about one-eighths inch in order to prevent significant damage to the carpet and underlying pad. Preferably, the resilient damper element is fabricated from a urethane-based polymer material which achieves controlled additional damping in the critical bass frequencies.