Patents by Inventor ALEXEY CHINKOV

ALEXEY CHINKOV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COLD PLATES AND LIQUID COOLING SYSTEMS FOR ELECTRONIC DEVICES
    Publication number: 20230025921
    Abstract: Cold plates and liquid cooling systems for electronic devices are disclosed herein. An example cold plate includes a body defining a cavity. The body has an inlet opening and an outlet opening fluidically coupled to the cavity such that a fluid passageway is defined between the inlet opening and the outlet opening. The cold plate also includes metal foam in the cavity.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 26, 2023
    Inventors: Devdatta Kulkarni, Alexey Chinkov, Brian Jarrett, Jeff King, John Gulick
  • TWO PHASE IMMERSION COOLING SYSTEM WITH USEABLE WARMED LIQUID OUTPUT
    Publication number: 20220256744
    Abstract: An apparatus is described. The apparatus includes a controller to cause a volume of an ambient of a two phase immersion cooling system to be modulated. The ambient is to include a condenser that is to emit fluid warmed by vapor in the ambient. The vapor is to be generated by heat. The heat is to be generated by electronic devices that are to be immersed in a liquid bath. The controller is to cause the volume to increase in response to a first temperature of the fluid approaching a first lower limit. The controller is to cause the volume to decrease in response to a second temperature of the fluid approaching a second higher limit.
    Type: Application
    Filed: December 20, 2021
    Publication date: August 11, 2022
    Inventors: Linh M. LE, Ra'anan SOVER, Alexey CHINKOV, James D. WILLIAMS, Paul C. GEORGE, Paul J. GWIN
  • IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
    Publication number: 20220201889
    Abstract: A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Applicant: Intel Corporation
    Inventors: Raanan Sover, James Williams, Bradley Smith, Nir Peled, Paul George, Jason Armstrong, Alexey Chinkov, Meir Cohen, Je-Young Chang, Kuang Liu, Ravindranath Mahajan, Kelly Lofgreen, Kyle Arrington, Michael Crocker, Sergio Antonio Chan Arguedas
  • Bios tracing using a hardware probe
    Patent number: 9459985
    Abstract: Methods and apparatuses may provide for tracing the performance of BIOS from the start of its execution. A hardware device such as a hardware probe may be connected to the processor on a target board and used to gather and transfer data to a host computer without resort to a COM port.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: October 4, 2016
    Assignee: Intel Corporation
    Inventors: Alexey Chinkov, Pavel Konev
  • BIOS TRACING USING A HARDWARE PROBE
    Publication number: 20150278070
    Abstract: Methods and apparatuses may provide for tracing the performance of BIOS from the start of its execution. A hardware device such as a hardware probe may be connected to the processor on a target board and used to gather and transfer data to a host computer without resort to a COM port.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 1, 2015
    Inventors: ALEXEY CHINKOV, PAVEL KONEV