Patents by Inventor Alexia Kekoa

Alexia Kekoa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bulk acoustic wave resonators having doped piezoelectric material and an adhesion and diffusion barrier layer
    Patent number: 11018651
    Abstract: Bulk acoustic wave (BAW) resonators, and electrical filters that incorporate the BAW resonators, are described. Generally, the BAW resonators comprise a substrate comprising an acoustic reflector; a first electrode disposed over the acoustic reflector; a piezoelectric layer disposed over the first electrode, the piezoelectric layer comprising scandium-doped aluminum nitride (ASN); a diffusion barrier layer disposed over the piezoelectric layer; and a second electrode disposed over the diffusion barrier layer. The diffusion barrier layer configured to prevent diffusion of material of the first electrode into the piezoelectric layer.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: May 25, 2021
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Domingo Figueredo, Hans G. Rohdin, Brice Ivira, Alexia Kekoa
  • BULK ACOUSTIC WAVE RESONATORS HAVING DOPED PIEZOELECTRIC MATERIAL AND AN ADHESION AND DIFFUSION BARRIER LAYER
    Publication number: 20190326880
    Abstract: Bulk acoustic wave (BAW) resonators, and electrical filters that incorporate the BAW resonators, are described. Generally, the BAW resonators comprise a substrate comprising an acoustic reflector; a first electrode disposed over the acoustic reflector; a piezoelectric layer disposed over the first electrode, the piezoelectric layer comprising scandium-doped aluminum nitride (ASN); a diffusion barrier layer disposed over the piezoelectric layer; and a second electrode disposed over the diffusion barrier layer. The diffusion barrier layer configured to prevent diffusion of material of the first electrode into the piezoelectric layer.
    Type: Application
    Filed: April 19, 2018
    Publication date: October 24, 2019
    Inventors: Domingo Figueredo, Hans G. Rohdin, Brice Ivira, Alexia Kekoa