Abstract: A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.

Abstract: The invention relates to a flip-chip assembly process for connecting two microelectronic components (1, 2) to each other. According to the invention, it is possible either to proportion the spacers (24) so that they are smaller than the interconnect bumps (22) or to oversize the latter so that their deformation, after having been plastic during the insertion of connective inserts (12), returns to the elastic regime once assembly contact between components (1,2) has been reached. Thanks to the invention, it is possible to control with great precision the gap between the two components during their assembly, and this without adding any additional steps to their manufacturing or to the assembly process.

Abstract: A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.

Abstract: The process for hybridizing a first microelectronic element (100) with a second microelectronic element (200) comprises moving the first and second microelectronic elements closer to generate an adhesive bond via interaction of first and second components (104, 202) of a two-component adhesive. At least one first member (103) and at least one second member (201) extends from said first and from second elements, respectively, the first and second components of the two-component adhesive being associated with said first and with said second elements, respectively. The first and second components are mixed via said at least one first and second members during the step of moving closer, and at the end of the step of moving closer the distance separating the first and second microelectronic elements is smaller than the cumulative height of said at least one first member and of said at least one second member before the movement closer.

Abstract: The invention relates to a flip-chip assembly process for connecting two microelectronic components (1, 2) to each other. According to the invention, it is possible either to proportion the spacers (24) so that they are smaller than the interconnect bumps (22) or to oversize the latter so that their deformation, after having been plastic during the insertion of connective inserts (12), returns to the elastic regime once assembly contact between components (1,2) has been reached. Thanks to the invention, it is possible to control with great precision the gap between the two components during their assembly, and this without adding any additional steps to their manufacturing or to the assembly process.