Abstract: The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element.

Abstract: The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element.

Abstract: Provided is a device for performing at least one of detection and emission of electromagnetic waves, including a plurality of antennas, in which a first antenna includes a first radiating element and a first electronic element electrically connected to the first radiating element, and is sensitive to a first frequency band, and in which a second antenna includes a second radiating element and a second electronic element electrically connected to the second radiating element, and is sensitive to a second frequency band. At least a part of the second radiating element is arranged inside the first radiating element.

Abstract: An imager for obtaining an image of an object includes a substrate including a plurality of electrical emitting units for emitting electromagnetic waves and a plurality of electrical detecting units for detecting the electromagnetic waves reflected by the object. Each emitting unit includes an electrical emitter, a first antenna, a first metallic reflector, and a first dielectric element between the first antenna and the first metallic reflector. Each detecting unit includes an electrical detector, a second antenna, a second metallic reflector, and a second dielectric element between the second antenna and the second metallic reflector.

Abstract: Provided is a device, which is configured to emit or receive an electromagnetic wave, including: a substrate; and an element provided on the substrate, the element including: an antenna; and an electronic element electrically connected to the antenna, and the substrate including: a recessed portion; a reflecting portion formed on a surface of the recessed portion; and a holding portion configured to hold the electronic element, the antenna including two portions opposed to each other, each of the two portions extending toward the electronic element and being electrically connected to the electronic element.

Abstract: Provided is an electromagnetic wave detecting/generating device, including: an electronic element; and an antenna electrically connected to the electronic element, the antenna including at least one coil-shaped portion in which the electromagnetic wave detecting/generating device is configured to be driven at a frequency within ±15% of a first anti-resonant frequency of the antenna.

Abstract: An electromagnetic wave detection/generation device including a substrate, and a plurality of reception/radiation elements provided on the substrate. In the electromagnetic wave detection/generation device, the plurality of reception/radiation elements each include an antenna and an electronic device, at least two of the reception/radiation elements are coated at least partially with dielectric layers, the dielectric layers each having a function of adjusting a frequency response characteristic of the antenna of the corresponding one of the reception/radiation elements, and at least two of the dielectric layers are different with respect to each other in at least either one of thickness, material, shape, and coating ratio.

Abstract: Provided is a device for performing at least one of detection and emission of electromagnetic waves, including a plurality of antennas, in which a first antenna includes a first radiating element and a first electronic element electrically connected to the first radiating element, and is sensitive to a first frequency band, and in which a second antenna includes a second radiating element and a second electronic element electrically connected to the second radiating element, and is sensitive to a second frequency band. At least a part of the second radiating element is arranged inside the first radiating element.

Abstract: Provided is a semiconductor device including: a semiconductor element arranged on a substrate and having two electrodes; a conductive strip in contact with one of the two electrodes; and a dielectric arranged between another one of the two electrodes and the conductive strip, in which the conductive strip has an opening formed therein, the dielectric has a void formed therein, and the opening and the void are connected to each other.

Abstract: The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element.

Abstract: An imager for obtaining an image of an object includes a substrate including a plurality of electrical emitting units for emitting electromagnetic waves and a plurality of electrical detecting units for detecting the electromagnetic waves reflected by the object. Each emitting unit includes an electrical emitter, a first antenna, a first metallic reflector, and a first dielectric element between the first antenna and the first metallic reflector. Each detecting unit includes an electrical detector, a second antenna, a second metallic reflector, and a second dielectric element between the second antenna and the second metallic reflector.

Abstract: Provided is a semiconductor device including: a semiconductor element arranged on a substrate and having two electrodes; a conductive strip in contact with one of the two electrodes; and a dielectric arranged between another one of the two electrodes and the conductive strip, in which the conductive strip has an opening formed therein, the dielectric has a void formed therein, and the opening and the void are connected to each other.

Abstract: A method of producing a valve includes the steps of forming a channel in a silicon substrate, with the channel having an opening penetrating an entire thickness of the silicon substrate, and forming, by patterning, a metal layer on one surface of the silicon substrate without closing the opening of the channel. In addition, a low melting point metal member is deposited so as to cover at least a part of the metal layer and also to block the opening of the channel.

Abstract: A valve includes a silicon substrate having first and second surfaces, a channel having an opening extending between both surfaces of the silicon substrate, and a metal pattern on the first surface of the silicon substrate. The metal pattern surrounds the opening on the first surface of the silicon substrate but does not close the opening. In addition, a low melting point metal member is disposed on the surface of the silicon substrate. The low melting point metal member covers at least a part of the metal pattern and completely closes the opening on the first surface of the silicon substrate.

Abstract: A micro-machined temperature dependent one-shot valve is provided which has an operation temperature adjustable readily, causing no leakage below the operation temperature even at a high pressure difference, being useful both in a liquid environment and in a gas environment, and being miniaturizable. The micro-machined temperature dependent one-shot valve comprises a silicon substrate 100, a channel 101 penetrating the entire thickness of the silicon substrate, and a low melting point metal member 101 deposited on one face of the silicon substrate to obstruct the channel.

Abstract: A micro-machined temperature dependent one-shot valve is provided which has an operation temperature adjustable readily, causing no leakage below the operation temperature even at a high pressure difference, being useful both in a liquid environment and in a gas environment, and being miniaturizable. The micro-machined temperature dependent one-shot valve comprises a silicon substrate 100, a channel 101 penetrating the entire thickness of the silicon substrate, and a low melting point metal member 101 deposited on one face of the silicon substrate to obstruct the channel.

Abstract: Provided is a valve having a structure in which the opening temperature of the valve can be set to an arbitrary temperature, scattering of contents other than a fluid is suppressed, and the valve can be used in both a liquid environment and a gas environment and can also be reduced in size. The valve includes: a silicon substrate; a channel having an opening extending between both surfaces of the silicon substrate; a metal layer formed on one of the surfaces of the silicon substrate without closing the opening of the channel; and a low melting point metal member deposited so as to cover at least a part of the metal layer and to block the opening of the channel.

Abstract: A micro-machined temperature dependent one-shot valve is provided which has an operation temperature adjustable readily, causing no leakage below the operation temperature even at a high pressure difference, being useful both in a liquid environment and in a gas environment, and being miniaturizable. The micro-machined temperature dependent one-shot valve comprises a silicon substrate 100, a channel 101 penetrating the entire thickness of the silicon substrate, and a low melting point metal member 101 deposited on one face of the silicon substrate to obstruct the channel.