Abstract: A heat sink assembly for thermally connecting a material to a thermal interface, having: a substrate plate having a bottom surface, a top surface and a thickness defined between the bottom and top surfaces, the substrate plate defines apertures that extend between the bottom and top surfaces; and conductive pins having bottom ends and top ends and a length defined between the bottom and top ends, wherein the length of the conductive pins is greater than the thickness of the substrate plate, and wherein the conductive pins are disposed in the apertures so that the bottom ends extend below the bottom surface to contact the material, wherein the conductive pins are configured for being independently moved within the apertures to conform with contours defined along the material when the substrate plate is against the thermal interface, to thereby provide a uniform thermal connection between the material and the thermal interface.