Abstract: A micromechanical sensor and, in particular, a silicon microphone, includes a movable membrane and a counter element in which perforation openings are formed, opposite to the movable membrane via a cavity. The perforation openings are formed by slots, the width of which maximally corresponds to double the spacing defined by the cavity between the membrane and the counter element.

Abstract: A pressure sensor having a substrate, a counter-structure applied to the substrate, a dielectric on the counter-structure, a membrane on the dielectric, wherein the membrane or the counter-structure deflectable by a pressure applied, a protective structure, wherein the protective structure is isolated from the counter-structure or the membrane, wherein the protective structure is arranged with regard to the membrane or the counter-structure such that a capacity forms between the protective structure and the membrane or the protective structure and the counter-structure, and a provider for providing a potential at the protective structure differing from a potential at the counter-structure or the membrane.

Abstract: In a method for manufacturing a device having a moveable structure a substrate is processed in order to obtain intermediate devices on the substrate, wherein an intermediate device comprises the moveable structure and a protective structure protecting the moveable structure. The substrate is diced in order to obtain a diced intermediate device comprising the protective structure. Subsequently, the protective structure is removed from the diced intermediate device in order to obtain the device. An apparatus for manufacturing a device includes means for performing the method steps.

Abstract: A pressure sensor having a substrate, a counter-structure applied to the substrate, a dielectric on the counter-structure, a membrane on the dielectric, wherein the membrane or the counter-structure deflectable by a pressure applied, a protective structure, wherein the protective structure is isolated from the counter-structure or the membrane, wherein the protective structure is arranged with regard to the membrane or the counter-structure such that a capacity forms between the protective structure and the membrane or the protective structure and the counter-structure, and a provider for providing a potential at the protective structure differing from a potential at the counter-structure or the membrane.

Abstract: In a method for producing a membrane for a device, e.g. a microphone, first, a substrate is provided, whereon a counter electrode is disposed. A sacrificial layer is provided on a surface of the counter electrode facing away from the substrate. The surface of the sacrificial layer facing away from the counter electrode is structured to form a plurality of recesses in the surface to define one or several antistick elements and one or several corrugation grooves at the same time. Subsequently, a membrane material is deposited on the structured surface of the sacrificial layer. Then, the sacrificial layer is removed to form the membrane, which has one or several corrugation grooves and one or several antistick elements.

Abstract: A microphone has a substrate including an acoustically transparent substrate region, a lid with an acoustically transparent lid region, and a membrane which is held by a membrane carrier between the lid and the substrate. The acoustically transparent substrate region or the acoustically transparent lid region is provided with at least one impedance hole sized so that an acoustic impedance of the impedance hole is larger than an acoustic impedance of the acoustically transparent region of the respective other region of substrate region and lid region.

Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.

Abstract: In a method for manufacturing a device having a moveable structure a substrate is processed in order to obtain intermediate devices on the substrate, wherein an intermediate device comprises the moveable structure and a protective structure protecting the moveable structure. The substrate is diced in order to obtain a diced intermediate device comprising the protective structure. Subsequently, the protective structure is removed from the diced intermediate device in order to obtain the device. An apparatus for manufacturing a device includes means for performing the method steps.

Abstract: A micromechanical sensor and, in particular, a silicon microphone, includes a movable membrane and a counter element in which perforation openings are formed, opposite to the movable membrane via a cavity. The perforation openings are formed by slots, the width of which maximally corresponds to double the spacing defined by the cavity between the membrane and the counter element.