Patents by Inventor Alfonso Hing Wan Ngan

Alfonso Hing Wan Ngan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11408403
    Abstract: Disclosed are actuators containing an active layer comprising at least one metal hydroxide, the active layer having a first volume under no stimulation and a second volume either greater than or smaller than the first volume under stimulation; and a passive layer comprising a porous polymer membrane, the passive layer having an elastic modulus at least half of an elastic modulus of the active layer.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: August 9, 2022
    Assignee: THE UNIVERSITY OF HONG KONG
    Inventors: Alfonso Hing Wan Ngan, Kin Wa Kwan, Runni Wu
  • Publication number: 20220128045
    Abstract: Disclosed are actuators containing an active layer comprising at least one metal hydroxide, the active layer having a first volume under no stimulation and a second volume either greater than or smaller than the first volume under stimulation; and a passive layer comprising a porous polymer membrane, the passive layer having an elastic modulus at least half of an elastic modulus of the active layer.
    Type: Application
    Filed: February 4, 2020
    Publication date: April 28, 2022
    Inventors: Alfonso Hing Wan Ngan, Kin Wa Kwan, Runni Wu
  • Patent number: 6883367
    Abstract: This invention relates to a method for measuring elastic modulus of a sample object. This invention also relates to a method for correcting creep effects in the modulus measurement. The error due to creep in the apparent contact compliance is equal to the ratio of the indenter displacement rate at the end of the load hold to the unloading rate. Determination of this error term and deduction of it from the measured contact compliance can be easily done at a low cost by modifying the data analysis software in any commercial depth-sensing indentation system.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: April 26, 2005
    Assignee: The University of Hong Kong
    Inventors: Gang Feng, Alfonso Hing Wan Ngan
  • Publication number: 20030094034
    Abstract: This invention relates to a method for measuring elastic modulus of a sample object. This invention also relates to a method for correcting creep effects in the modulus measurement. The error due to creep in the apparent contact compliance is equal to the ratio of the indenter displacement rate at the end of the load hold to the unloading rate. Determination of this error term and deduction of it from the measured contact compliance can be easily done at a low cost by modifying the data analysis software in any commercial depth-sensing indentation system.
    Type: Application
    Filed: November 20, 2002
    Publication date: May 22, 2003
    Inventors: Gang Feng, Alfonso Hing Wan Ngan