Patents by Inventor Alfred B. Meyer

Alfred B. Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5147974
    Abstract: In a weapon subject to linear acceleration and spin, including a detonator and an explosive charge, the safing and arming device comprising a housing, a setback spring configuration restraining a ribbon spiral unwinder, and a detonator-enabling circuit which provides a fail safe for the omission of the safing and arming device from the fuze assembly.
    Type: Grant
    Filed: November 6, 1990
    Date of Patent: September 15, 1992
    Assignee: Motorola Inc.
    Inventors: Monty W. Bai, Danny E. Minks, Alfred B. Meyer
  • Patent number: 4581505
    Abstract: An apparatus and method is disclosed for providing an impact switch that is non-critical to rotational forces. The impact switch consists of a plate having an "X" beam disposed therein that is capable of flexing. A mass is located in the center on one side of the beam. The plate is covered by a housing having a pin extending therethrough. The cover is placed such that when the required force is exerted on the beam it will flex causing the mass and pin to come in contact thereby completing an electrical circuit. The force required to make contact can be varied by changing the weight of the mass and/or the material or dimension of the beam.
    Type: Grant
    Filed: December 26, 1984
    Date of Patent: April 8, 1986
    Assignee: Motorola, Inc.
    Inventors: Monty W. Bai, Alfred B. Meyer
  • Patent number: 4495792
    Abstract: A method for simulating a shock pulse on an encapsulated component wherein the encapsulated component is placed in a specimen container attached to an end of a pressure bar having a mass and a drop height chosen to simulate the shock pulse. The specimen container attached to the pressure bar is dropped on an anvil and the resulting shock pulse is monitored using strain gauges. Otherwise unencapsulated components may also be tested by this method if the component is surrounded by resilient material before testing.
    Type: Grant
    Filed: May 2, 1983
    Date of Patent: January 29, 1985
    Assignee: Motorola, Inc.
    Inventors: Monty W. Bai, Alfred B. Meyer