Patents by Inventor Alfred Bachler

Alfred Bachler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip receptacle, method for fabricating a chip receptacle and chip transport container
    Patent number: 7445119
    Abstract: Cavities for holding semiconductor chips are etched anisotropically into a semiconductor wafer. An orientation of the wafer in the (100) pulling direction results in geometrically exactly etched sidewalls of the cavities with an angle of 125.3°. What is thereby achieved is that chips can slip into the cavity with a low risk of damage. A transparent cover plate is situated on the cavity plate.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: November 4, 2008
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Mathias Kaempf, Frank Singer, Jurgen Dachs, Alfred Bachler
  • Chip receptacle, method for fabricating a chip receptacle and chip transport container
    Publication number: 20050002763
    Abstract: Cavities for holding semiconductor chips are etched anisotropically into a semiconductor wafer. An orientation of the wafer in the (100) pulling direction results in geometrically exactly etched sidewalls of the cavities with an angle of 125.3°. What is thereby achieved is that chips can slip into the cavity with a low risk of damage. A transparent cover plate is situated on the cavity plate.
    Type: Application
    Filed: April 29, 2004
    Publication date: January 6, 2005
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Mathias Kampf, Frank Singer, Jurgen Dachs, Alfred Bachler