Patents by Inventor Alfred Edtmair

Alfred Edtmair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060035458
    Abstract: The invention relates to a semiconductor component having a semiconductor body (1), to which a metallization (10), which is formed from metallization layers (11, 13, 15, 17) and separating layers (12, 14, 16, 18) arranged alternately in succession, a dielectric (2) and a molding compound (3) joined to the dielectric (2) are applied alternately in succession.
    Type: Application
    Filed: July 26, 2005
    Publication date: February 16, 2006
    Applicant: Infineon Technologies AG
    Inventors: Peter Nelle, Renate Hofmann, Jorg Busch, Alfred Edtmair, Manfred Schneegans, Matthias Stecher