Patents by Inventor Alfred Faust

Alfred Faust has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5926944
    Abstract: An AC adapter for use with a portable computer has a primary transformer disposed within a plastic housing. A shielded heat sink assembly is positioned in the housing between the transformer and a facing interior side surface portion of the housing. The shielded heat sink assembly includes a resilient block of thermally conductive, high dielectric strength silicon material pressed into contact with a thermally conductive copper heat transfer band wrapped around the housing of the transformer. From its contact area with the copper band the silicon block extends through an opening in a black-colored plastic radiant shield sheet and is adhered to the inner side of a copper heat sink sheet with a thermally conductive adhesive material that also adheres the outer side of the plastic shield sheet to the inner side of the copper heat sink sheet. The outer side of the copper heat sink sheet is adhered to the facing interior side surface portion of the housing with thermally conductive adhesive material.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: July 27, 1999
    Assignee: Compaoq Computer Corporation
    Inventors: Darryl K. Smith, Alfred Faust
  • Patent number: 5726858
    Abstract: An AC adapter for use with a portable computer has a primary transformer disposed within a plastic housing. A shielded heat sink assembly is positioned in the housing between the transformer and a facing interior side surface portion of the housing. The shielded heat sink assembly includes a resilient block of thermally conductive, high dielectric strength silicon material pressed into contact with a thermally conductive copper heat transfer band wrapped around the housing of the transformer. From its contact area with the copper band the silicon block extends through an opening in a black-colored plastic radiant shield sheet and is adhered to the inner side of a copper heat sink sheet with a thermally conductive adhesive material that also adheres the outer side of the plastic shield sheet to the inner side of the copper heat sink sheet. The outer side of the copper heat sink sheet is adhered to the facing interior side surface portion of the housing with thermally conductive adhesive material.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: March 10, 1998
    Assignee: Compaq Computer Corporation
    Inventors: Darryl K. Smith, Alfred Faust