Abstract: A device for cooling a multiplicity of solid state components which are attached to a printed circuit board comprises a formed profile member of high thermal conductivity material having a pair of longitudinally connected sides which form a geometrically shaped channel extending along its entire length for dissipation of thermal energy away from the components. The sides of the device are formed to provide a resilient springlike characteristic for frictionally engaging and holding the device in intimate contact with the surfaces of the solid state components to be cooled. This same characteristic facilitates manual installation and removal of the cooling device without the need for or use of special tools.