Patents by Inventor Alfred Groeber

Alfred Groeber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacture of fine structures for semiconductor contacting
    Patent number: 4795694
    Abstract: A method for the manufacture of fine structures for semiconductors were in a photographic structuring is carried out on both sides of a smooth, non-stressed metal tape. The tape is etched from both sides. A single sided metal deposition than takes place by means of a float type electroplating. Stabilization of the fine structure is achieved by depositing a lacquer or resin by an electrophoretic deposition or by electro-immersion lacquering. The insulator carrier is applied as one of the final steps of the process.
    Type: Grant
    Filed: May 21, 1987
    Date of Patent: January 3, 1989
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alfred Groeber, Hans Hadersbeck, Fritz Mueller, Hubert Zukier, Hans J. Hacke
  • Flexible through-contacted printed circuits
    Patent number: 4121044
    Abstract: A flexible printed circuit board has conductors on opposite sides thereof which are through-contacted by die-punching the board to form an angularly-displaced tongue portion about which solder is flowed to contact both conductors. A terminal pin is optionally inserted through the board to connect a component, the pin being engaged by the angularly-displaced tongue to ensure reliable mechanical and electrical contact in the soldered joint. The through-contact is formed with a bevel-faced die in conjunction with a cutting plate.
    Type: Grant
    Filed: May 26, 1976
    Date of Patent: October 17, 1978
    Assignee: Siemens Aktiengesellschaft
    Inventors: Hans Hadersbeck, Ernst Andrascek, Alfred Groeber