Patents by Inventor Alfred Gruber
Alfred Gruber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8703274Abstract: A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.Type: GrantFiled: October 2, 2008Date of Patent: April 22, 2014Assignee: International Business Machines CorporationInventors: Russell A. Budd, Bing Dang, William S. Graham, Peter Alfred Gruber, Richard Levine, Da-Yuan Shih
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Patent number: 8561880Abstract: A process and tools for forming and/or releasing metal preforms, metal shapes and solder balls is described incorporating flexible molds or sheets, injection molded metal such as solder and in the case of solder balls, a liquid or gaseous environment to reduce or remove metal oxides prior to or during metal (solder) reflow to increase surface tension to form spherical or substantially spherical solder-balls.Type: GrantFiled: February 11, 2012Date of Patent: October 22, 2013Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Patent number: 8408448Abstract: A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.Type: GrantFiled: February 11, 2012Date of Patent: April 2, 2013Assignee: International Business Machines CorporationInventors: Claudius Feger, Peter Alfred Gruber, Mark Harrison McLeod, Jae-Woong Nah
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Patent number: 7906420Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: GrantFiled: November 30, 2009Date of Patent: March 15, 2011Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Patent number: 7867842Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: GrantFiled: July 29, 2008Date of Patent: January 11, 2011Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20100086739Abstract: A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.Type: ApplicationFiled: October 2, 2008Publication date: April 8, 2010Applicant: International Business Machines CorporationInventors: Russell A. Budd, Bing Dang, William S. Graham, Peter Alfred Gruber, Richard Levine, Da-Yuan Shih
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Publication number: 20100072263Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: ApplicationFiled: November 30, 2009Publication date: March 25, 2010Applicant: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20100025862Abstract: Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.Type: ApplicationFiled: July 29, 2008Publication date: February 4, 2010Inventors: Peter Alfred Gruber, Jae-Woong Nah
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Publication number: 20100025863Abstract: Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.Type: ApplicationFiled: July 28, 2009Publication date: February 4, 2010Applicant: International Business Machines CorporationInventors: Peter Alfred Gruber, Jae-Woong Nah
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Publication number: 20100028612Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: ApplicationFiled: July 29, 2008Publication date: February 4, 2010Inventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20090039140Abstract: A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.Type: ApplicationFiled: August 6, 2007Publication date: February 12, 2009Inventors: Raschid Jose Bezama, Russell Alan Budd, Evan George Colgan, Peter Alfred Gruber, Valerie Oberson
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Publication number: 20090039142Abstract: A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.Type: ApplicationFiled: August 6, 2007Publication date: February 12, 2009Inventors: Raschid Jose Bezama, Russell Alan Budd, Evan George Colgan, Peter Alfred Gruber, Valerie Oberson
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Patent number: 6832747Abstract: Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer.Type: GrantFiled: April 23, 2002Date of Patent: December 21, 2004Assignee: International Business Machines CorporationInventors: Steven A. Cordes, David Hirsch Danovitch, Peter Alfred Gruber, James Louis Speidell, Joseph Peter Zinter
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Patent number: 6708872Abstract: There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.Type: GrantFiled: March 27, 2002Date of Patent: March 23, 2004Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Chon Cheong Lei
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Patent number: 6581280Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.Type: GrantFiled: July 17, 2002Date of Patent: June 24, 2003Assignee: International Business Machines CorporationInventors: Brian Eugene Curcio, Peter Alfred Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark David Poliks
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Patent number: 6527158Abstract: The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface. The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 &mgr;m per inch of die length.Type: GrantFiled: March 28, 2000Date of Patent: March 4, 2003Assignee: International Business Machines CorporationInventors: Guy Paul Brouillette, Peter Alfred Gruber, Frederic Maurer
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Publication number: 20030024968Abstract: There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.Type: ApplicationFiled: March 27, 2002Publication date: February 6, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Peter Alfred Gruber, Chon Cheong Lei
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Publication number: 20020179335Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.Type: ApplicationFiled: July 17, 2002Publication date: December 5, 2002Applicant: International Business Machines CorporationInventors: Brian Eugene Curcio, Peter Alfred Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark David Poliks
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Patent number: 6452117Abstract: High aspect ratio (5:1-30:1) and small (5 &mgr;m-125 &mgr;m) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.Type: GrantFiled: May 31, 2001Date of Patent: September 17, 2002Assignee: International Business Machines CorporationInventors: Brian Eugene Curcio, Peter Alfred Gruber, Frederic Maurer, Konstantinos I. Papathomas, Mark David Poliks
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Publication number: 20020125402Abstract: Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer.Type: ApplicationFiled: April 23, 2002Publication date: September 12, 2002Applicant: International Business Machines CorporationInventors: Steven A. Cordes, David Hirsch Danovitch, Peter Alfred Gruber, James Louis Speidell, Joseph Peter Zinter